Capacitive Proximity Communication With Distributed Alignment Sensing for Origami Biomedical Implants

Matthew Loh, Azita Emami-Neyestanak
2015 IEEE Journal of Solid-State Circuits  
Origami implant design is a 3D integration technique which addresses size and cost constraints in biomedical implants. A capacitive proximity interconnect that enables this technique is presented. The interconnect embeds an alignment sensor that measures link quality directly and simplifies its adaptation to alignment. The sensor and transceiver share functional blocks, saving power and area. Data rates from 10-60 Mbps are achieved over 4-12 µm of parylene-C, with efficiencies up to 0.180 pJ/bit.
doi:10.1109/jssc.2015.2404335 fatcat:enl76jctm5fjloqv6gysbovlsq