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A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip
2006
Proceedings of the 43rd annual conference on Design automation - DAC '06
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor System-On-Chip (MPSoC) architectures have become widespread. These new systems are complex to design as they must execute multiple complex applications (e.g. video processing, 3D games), while meeting additional design constraints (e.g. energy consumption or time-to-market). Moreover, the rise of temperature in the die for MPSoC components can seriously affect their final
doi:10.1145/1146909.1147068
dblp:conf/dac/AtienzaVPPBMM06
fatcat:5wr5eg5dwva6zcb7nkkfeeiae4