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2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
Through-silicon via (TSV) technology, an enabler for 3D ICs, has evolved, enabling thinner and shorter TSVs within substantially thinned wafers to achieve faster interconnects, large bandwidth density, and low power consumption. Yet, heat dissipation in 3D ICs becomes more and more challenging, especially in applications that require stacking of multiple processor and memory chips. Microfluidic cooling has been proposed as a solution to reject heat from 3D stacks that contain processor chips.doi:10.1109/ectc.2011.5898797 fatcat:6euu4gwcprfpzk6djzz5wciyoy