A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit the original URL.
The file type is
Proceedings 2000. Design Automation Conference. (IEEE Cat. No.00CH37106)
System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory. The key elements of SIP technology include I/O redistribution, solder bumping, flip chip assembly, and high density thin film interconnect substrate with/without integrated passives. To meet the need of SIP, as well as other advanced packaging solutions, APack Technologies has been set up to serve worldwide customers. High quality of the APack's service is built upon the SIPdoi:10.1109/aspdac.2000.835096 fatcat:iahyosvs4jaspi6d7yiienpoke