Taiwan foundry for System-In-Package (SIP)

A.W. Lin
Proceedings 2000. Design Automation Conference. (IEEE Cat. No.00CH37106)  
System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory. The key elements of SIP technology include I/O redistribution, solder bumping, flip chip assembly, and high density thin film interconnect substrate with/without integrated passives. To meet the need of SIP, as well as other advanced packaging solutions, APack Technologies has been set up to serve worldwide customers. High quality of the APack's service is built upon the SIP
more » ... n the SIP technology licensed from Bell Labs of Lucent Technologies, and the experience of cost competitive wafer fabrication of foundries in Taiwan.
doi:10.1109/aspdac.2000.835096 fatcat:iahyosvs4jaspi6d7yiienpoke