SU8 resist plasma etching and its optimisation

Guodong Hong, A.S. Holmes, M.E. Heaton
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003.  
The thick photoresist SU8, by virtue of its good mechanical durability, water impermeability and dielectric properties on polymerisation, is widely used as a resin for making high aspect ratio, functional MEMS device structures and packaging parts. However, the difficulty associated with removal, stripping or re-patterning of the polymerised SU8 remains a serious issue. This paper presents a novel process, based on O 2 /SF 6 plasma etching, for patterning or removal of fully cross-linked SU8.
more » ... e Taguchi methodology is used to optimise the O 2 /SF 6 mix for a high etch rate and low under cut.
doi:10.1109/dtip.2003.1287050 fatcat:me76hi4345hirdz4pe5eacmtpe