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SU8 resist plasma etching and its optimisation
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003.
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The thick photoresist SU8, by virtue of its good mechanical durability, water impermeability and dielectric properties on polymerisation, is widely used as a resin for making high aspect ratio, functional MEMS device structures and packaging parts. However, the difficulty associated with removal, stripping or re-patterning of the polymerised SU8 remains a serious issue. This paper presents a novel process, based on O 2 /SF 6 plasma etching, for patterning or removal of fully cross-linked SU8.
doi:10.1109/dtip.2003.1287050
fatcat:me76hi4345hirdz4pe5eacmtpe