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Increase in melting temperature of joints by enhanced interfacial reaction of Sn-Ag solder with Au/Ni-Co plating
Sn-AgはんだとAu/Ni-Coめっきとの界面反応促進による接合部高融点化

Takashi Yamamoto, Shigeaki Sakatani, Keisuke Uenishi, Kojiro Kobayashi, Masaaki Ishio, Kazuhiro Shiomi, Akio Hashimoto, Masaharu Yamamoto
2003

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doi:10.14920/jwstaikai.2003f.0.226.0 fatcat:o2r33h27yfc7foppjl6ai53tee
lang:ja
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Takashi Yamamoto, Shigeaki Sakatani, Keisuke Uenishi, Kojiro Kobayashi, Masaaki Ishio, Kazuhiro Shiomi, Akio Hashimoto, Masaharu Yamamoto. "Increase in melting temperature of joints by enhanced interfacial reaction of Sn-Ag solder with Au/Ni-Co plating." (2003) 226-226