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Non-Gaussian analysis of noise for metal interconnection electromigration
2012
Wuli xuebao
Preserved Fulltext
Based on scattering theory, the resistance of polycrystalline interconnection originates mainly from vacancies and voids scattering at grain boundary. Through using the free volume concept, the scattering process at grain boundary is simulated, and a non-Gaussian model of noise is establised. The model shows the earlier electromigration noise is gaussian, through electromigration process, noise turns non-Gaussian, which reflects the change of dynamic mechanism. Bicoherence coefficient is used
doi:10.7498/aps.61.206601
fatcat:yglqls6z4ngrvlahjienjmv7li