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The present paper describes an integrated approach for design, fabrication and encapsulation of RF MEMS switches in view of the optimal performance subsequent to packaging. 'Top and bottom contact' fabrication approaches are explored using different RF MEMS switch topologies. In the 'bottom contact package (BCP)' the packaging cap alignment is less critical as compared to the top contact packaging (TCP) approach where contact via is an integral part of the cap. In this case, the connectiondoi:10.2528/pierm14073002 fatcat:hdmotomiybbijnf4laubi5aayy