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Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs

Ashish Dembla, Yue Zhang, Muhannad S. Bakir
2012 2012 IEEE International Interconnect Technology Conference  

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Future high performance 3D systems require a systematic co-design of their electrical interconnect network and their heat removal mechanism. This paper presents fine pitch (20µm) and high aspect ratio (18:1) TSVs integrated in a micropin-fin heat sink capable of removing power density of 100W/cm 2 and resulting in junction temperatures below 50 ºC.
doi:10.1109/iitc.2012.6251587 fatcat:g3r7ugz6ybguxcrvl4gwuf5l4a
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Ashish Dembla, Yue Zhang, Muhannad S. Bakir. "Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs." 2012 IEEE International Interconnect Technology Conference (2012)