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Thermal Design of LED by DOE
Electrical and Electronics Engineering An International Journal
The article analyses the influence of the design parameters of the structure of the heat sink with round pins on the junction temperature of the LED system. The study uses design of experiment (DOE) and thermal simulations to determine the factors that have the greatest impact to improve the cooling capacity and finding the optimal heat sink design. The results of thermal design and simulation of the LED system have been validated experimentally using a thermocouple and they show that the errordoi:10.14810/elelij.2015.4401 fatcat:vcqmrkbpbbacrmaezduehvxg74