Bondability of Ag Nanoparticles in Pressureless Bonding Process
無加圧条件下における銀ナノ粒子の接合特性評価

長岡 亨, 森貞 好昭, 福角 真男, 柏木 行康, 山本 真理, 中許 昌美, 垣内 宏之, 吉田 幸雄
2010 MES  
This study describes bondability of Ag nanoparticles coated with organic shells in a pressureless bonding process. Three kinds of Ag nanoparticles (mean particle size: d = 20.2 nm, 58.5 nm, and 168 nm) were characterized by TEM observations and TG-DTA analysis. These Ag nanoparticles and mixed Ag nanoparticles comprised of them were subjected to bonding tests using Cu disk specimens. The bonding strength of the joints using the nanoparticles was examined by shear tests. The joints using mixed
more » ... nanoparticles showed higher shear strength than the joints using each Ag nanoparticles. The differences in the microstructure of the sintered layer formed by the Ag nanoparticles and mixed Ag nanoparticles were discussed.
doi:10.11486/mes.20.0_35 fatcat:wf2ugraefbfynnc2wgyocl6wzy