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Bondability of Ag Nanoparticles in Pressureless Bonding Process
無加圧条件下における銀ナノ粒子の接合特性評価
2010
MES
無加圧条件下における銀ナノ粒子の接合特性評価
This study describes bondability of Ag nanoparticles coated with organic shells in a pressureless bonding process. Three kinds of Ag nanoparticles (mean particle size: d = 20.2 nm, 58.5 nm, and 168 nm) were characterized by TEM observations and TG-DTA analysis. These Ag nanoparticles and mixed Ag nanoparticles comprised of them were subjected to bonding tests using Cu disk specimens. The bonding strength of the joints using the nanoparticles was examined by shear tests. The joints using mixed
doi:10.11486/mes.20.0_35
fatcat:wf2ugraefbfynnc2wgyocl6wzy