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Reliability studies of surface mount, solder joints-effect of Cu-Sn intermetallic compounds
1995 Proceedings. 45th Electronic Components and Technology Conference
Cu-Sn intermetallic compounds (IMC), formed at the interface between the solder and the copper substrate are found to play an important role in determining the thermal fatigue life of a surface mount solder joint. In order to predict the growth of this IMC layer during the operating life of the solder joint and its effect on the thermal fatigue life, the formation characteristics of Cu-Sn IMCs in 0805 and 1206 LCCC solder joints fabricated from an TRreflow process are investigated in this work.
doi:10.1109/ectc.1995.517824
fatcat:begu2tqvsndexk6yd7zpcltmdi