112 Hits in 4.0 sec

Development of a micro-fabrication process for micro devices

Ryo Hibino, Masahiko Yoshino
2007 Proceedings of International Conference on Leading Edge Manufacturing in 21st century LEM21  
The process is separated into 5 steps; nano plastic forming, nickel plating, peeling, polishing, and picking up.  ...  This paper proposes new micro fabrication processes of metallic materials by combination of nano plastic forming, plating and polishing.  ...  Introduction Recent studies on nano/micro technologies challenges development of new minute devices such as MEMS, μ-TAS, and micro machine.  ... 
doi:10.1299/jsmelem.2007.4.8e517 fatcat:46xyvtdm65c2jjflws6fvorhv4

Wafer Level Packaging of Compound Semiconductors

Andrew Strandjord, Thorsten Teutsch, Axel Scheffler, Bernd Otto, Anna Paat, Oscar Alinabon, Jing Li
2010 Journal of Microelectronics and Electronic Packaging  
The largest production volumes for these technologies are for silicon-based semiconductors.  ...  This limits the number of places that one can outsource the processing of 100 and 150 mm compound semiconductor wafers.  ...  ACKNOWLEDGEMENTS The authors would like to thank all the engineers and technicians at PacTech for their contributions to this project.  ... 
doi:10.4071/imaps.263 fatcat:irwn3opnerbbdbgjqbjdl4quwa

30 years of electroless plating for semiconductor and polymer micro-systems

Y. Shacham-Diamand, T. Osaka, Y. Okinaka, A. Sugiyama, V. Dubin
2015 Microelectronic Engineering  
In the last 30 years electroless plating of metals (e.g. copper, gold, nickel, cobalt, palladium, iron, silver, etc.) and their alloys, was demonstrated for micro system applications: microelectronics,  ...  Electroless deposition (ELD) is a well-known method for preparing thin films of metals and their alloys.  ...  Acknowledgements In summary of the last 30 years one should pay tribute to the individuals and groups who contributed to the field of electroless plating along those years.  ... 
doi:10.1016/j.mee.2014.09.003 fatcat:mowxpjgocvd5rnndfgaywwvxsq

Electroplated Nickel Permanent Magnetic Films over Polymeric Membranes

C. D. M Campos, A. Flacker, A. R. Vaz, S. A. Moshkalev, E. G. O. Nobrega
2011 Journal of the Electrochemical Society  
The influence of a magnetic field on electrodeposition of nickel films over polymeric substrates, which renders flexible membranes with a permanent magnet layer, has been studied.  ...  The palladium metal atoms form clusters and the seed layer which catalyzes the electroless nickel deposition. 35,36 z  ...  of UV light source, and FAPESP for the financial support.  ... 
doi:10.1149/1.3571035 fatcat:ltkuq773djhd7kb2tfevydtmiu

Index [chapter]

2011 Modern Electroplating  
acidic electroless platinum plating bath, 479 alkaline electroless platinum plating bath, 479 alloys for, 480 electroless plating bath, 479 electroless Pt-Rh alloy plating bath, 480 on specific  ...  441 quality control, 637 secondary ion micrography of electroplated, 646 SEM micrographs, defects on electroplated Cu film, 647, 648 solutions for electroplating, 639 steady-state electroless copper  ... 
doi:10.1002/9780470602638.index fatcat:6f5xcgt65bdfpci6lb7lssbzci

Preparation and characterization of novel nickel–palladium electrodes supported by silicon microchannel plates for direct methanol fuel cells

Fengjuan Miao, Bairui Tao, Li Sun, Tao Liu, Jinchuan You, Lianwei Wang, Paul K. Chu
2010 Journal of Power Sources  
A novel anode structure based on the three-dimensional silicon microchannel plates (Si-MCP) is proposed for direct methanol fuel cells (DMFCs).  ...  In order to evaluate the electroactivity of the nanocomposites, Ni-Pd/silicon composites synthesized by the same method are compared.  ...  This work was also financially supported by the China NSFC support under the contract of Grant no. 50672027 and Hong Kong Research Grants Council (RGC) General Research Funds (GRF) no. CityU 112307.  ... 
doi:10.1016/j.jpowsour.2009.07.006 fatcat:n6x2cteijngmrlisrotfam253a

Technologies for Cofabricating MEMS and Electronics

G.K. Fedder, R.T. Howe, Tsu-Jae King Liu, E.P. Quevy
2008 Proceedings of the IEEE  
Several different strategies show commercial promise for fabricating electronic and micro electromechanical devices on the same substrate; a de-facto standard has not yet been chosen.  ...  Zolper of DARPA Microsystems Technology Office for their support, which has catalyzed the development of integrated MEMS.  ...  This step can be accomplished through a series of intermediate zincation and nickel electroless plating steps [81] by direct electroless gold deposition without intermediate steps [82] or by sputtering  ... 
doi:10.1109/jproc.2007.911064 fatcat:4cgy5gufijhnzjwsykka5ltdkq

Flexible shear-stress sensor skin and its application to unmanned aerial vehicles

Yong Xu, Fukang Jiang, Scott Newbern, Adam Huang, Chih-Ming Ho, Yu-Chong Tai
2003 Sensors and Actuators A-Physical  
This paper describes the development of flexible shear-stress sensor skin and its application on the detection of leading edge flow separation for delta planform unmanned aerial vehicles (UAVs).  ...  Shear-stress information is of great interest for many fluidic dynamic monitoring/diagnostics application. To obtain such information on non-planar surfaces has long been a significant challenge.  ...  electroless Ni/Au plating, Dave Ganzer, Emil Ghapgharan and Mark Levoe for the UAV flight test.  ... 
doi:10.1016/s0924-4247(03)00230-9 fatcat:xbbq3p4kinfptmsq5mcnaunwee

Three-dimensional thin-film Li-ion microbatteries for autonomous MEMS

M. Nathan, D. Golodnitsky, V. Yufit, E. Strauss, T. Ripenbein, I. Shechtman, S. Menkin, E. Peled
2005 Journal of microelectromechanical systems  
The films are deposited sequentially on all available surfaces of a perforated substrate (e.g., silicon or a glass microchannel plate or "MCP") using wet chemistry.  ...  The technology has been developed, and full 3-D cells have been manufactured on both glass and silicon substrates.  ...  The electroless process yields a uniform 2-4 -thick nickel layer both inside the microchannels and on the flat areas.  ... 
doi:10.1109/jmems.2005.851860 fatcat:2h573h4jcrbdncniz4ekoqqdwm

Advanced materials for the 3D microbattery

D. Golodnitsky, V. Yufit, M. Nathan, I. Shechtman, T. Ripenbein, E. Strauss, S. Menkin, E. Peled
2006 Journal of Power Sources  
Out recent achievements in the development of three-dimensional (3D) thin film microbatteries on silicon and on microchannel plates (MCP) are presented.  ...  A special flow cell for conformal coating of the perforated substrates was designed.  ...  F61775-01-WE020, FeS cathodes), for partial support of this project.  ... 
doi:10.1016/j.jpowsour.2005.05.029 fatcat:wxxrawxgsnhxzmwxnow4qjki24

Advances in LIGA-based post mold fabrication

Todd R. Christenson, James H. Smith
1998 Micromachining and Microfabrication Process Technology IV  
New materials work has centered on magnetic materials including precision micromagnets and surface treatments of electrodeposited materials.  ...  Assembly and packaging has been aided by deep silicon etch processing and the use of conventional precision milling equipment combined with press-fit assembly.  ...  of MEMS.  ... 
doi:10.1117/12.324299 fatcat:6tt2h4ccozcrfm23agi57ya4u4

Nanoindentation and micro-mechanical fracture toughness of electrodeposited nanocrystalline Ni–W alloy films

D.E.J. Armstrong, A.S.M.A. Haseeb, S.G. Roberts, A.J. Wilkinson, K. Bade
2012 Thin Solid Films  
Nanocrystalline nickel-tungsten alloys have great potential in the fabrication of components for microelectromechanical systems. Here the fracture toughness of Ni-12.7 at.  ...  This is higher than the fracture toughness of Si (another important microelectromechanical systems material), but considerably lower than that of electrodeposited nickel and other nickel based alloys.  ...  mainly on electrodeposited nickel as the construction material.  ... 
doi:10.1016/j.tsf.2012.02.059 fatcat:khsdhuqwlrcqth7yr4oiptt35q

Porous Silicon Sensors- Elusive and Erudite

Prof. H. Saha
2008 International Journal on Smart Sensing and Intelligent Systems  
The barriers of porous silicon like contact, non-uniformity, instability etc. are also discussed.  ...  Brief description of fabrication and properties of all these types of different sensors is reported in this paper.  ...  Fig.6. 3 3 Variation of relative change capacitance with frequency for different NaCl concentration contacts on porous silicon have been realized by electroless nickel deposition from a very weakly alkaline  ... 
doi:10.21307/ijssis-2017-277 fatcat:d6kirifs2bethmbtaa5nomqto4

A review and comparative study of release coatings for optimised abhesion in resin transfer moulding applications

G.W. Critchlow, R.E. Litchfield, I. Sutherland, D.B. Grandy, S. Wilson
2006 International Journal of Adhesion and Adhesives  
Electroless Ni/PTFE composite coatings comprise hard nickel-phosphorus matrix containing a very fine dispersion of PTFE particles.  ...  In this study, a number of abhesion promoting coatings were considered in terms of their physicochemical and release properties.  ...  initially studied: sputter coated nickel on glass; polished nickel, and; industrially-sourced abraded nickel.  ... 
doi:10.1016/j.ijadhadh.2005.09.003 fatcat:yggmbwj3xzdxzniewnxtzehlwy

Electrodeposition Science and Technology in the Last Quarter of the Twentieth Century

D. Landolt
2002 Journal of the Electrochemical Society  
Electropolishing finds numerous applications in the manufacturing industry for polishing of metallic objects of complex shape.  ...  systems (MEMS).  ... 
doi:10.1149/1.1469028 fatcat:75gaqjzxtbamxgqlkccsuta6eu
« Previous Showing results 1 — 15 out of 112 results