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Micro & Nano Letters
Three-dimensional (3D) integration is an emerging technology that aims to achieve efficient packaging of the multifunctional silicon (Si) die within a single chip package. This system in package approach achieves connectivity between the individual Si die using through Si via (TSV) technology. Coaxial TSVs have emerged as the preferred 3D interconnect for high-frequency packaging applications due to their superior high-frequency electrical characteristics. The interconnect utilises a copperdoi:10.1049/mnl.2018.5280 fatcat:rrec4z7yovhprkg67czttbkefy
more »... ld to prevent noise and unwanted signal coupling to occur within the Si substrate. However, a potential disadvantage of 3D integration is the large transistor keep-out-zones (KOZs) required to prevent transistor variability caused by thermally induced stress due to the copper-based TSVs in the Si substrate. Currently, only analytical models exist that predict KOZs for various coaxial TSV configurations and determining the precise KOZ is critical to minimise interconnect footprint that results in increased costs due to reductions in Si die area for integrated circuit designers. For the first time, the work has characterised the thermomechanical behaviour of fabricated coaxial TSVs utilising the microRaman spectroscopy technique to define transistor KOZ for both analogue and digital circuital applications.
Sage Family Studies Abstracts
Abell, Frances, 0855 Ablon, Stuart, 0772 Achille, Pier Angelo, 0611 Adams, Gregory, 0672 Adamshick, Pamela, 0604 Adelman, Madelaine, 0804 Afrank, Jan, 0739 Agnew, Robert, 0722 Ahmed, Shahina, 0727 Akkerman ... Bradley, Lisa M., 0684 Bradley, Loretta J., 0655 Bradley, Robert H., 0711 Branch, Kathryn A., 0807 Brew, Leah, 0781 Briar-Lawson, Katherine, 0840 Briggs, Adam C., 0687 Briggs, Harold E., 0687 Briggs, Stephen ...
K Abelson, Robert B Abidov, A.A Abrahamson, Stephen Abramezyk, Rudolf R Ac Ac 13110 13240, 13241 12581 12186 ker, Loren E., 13400 1 Hoc Report Committee. 13270 2748 Adam, Morton §., | Adamshick, Donald ... A., 12667 Bobrow, Samuel A., 12226 Bochner, Stephen, 12830 Bodakva, A. P., 12517 Boeva, E. M.. 13221 Bogoslovskii, M. ...
Allen, Stephen, Buffalo, N.Y. Alling, Mrs. Isabelle L., Vancouver, Wash. Almasy, Mrs. Jane, Pittsburgh, Pa. Ateaeoeh, James V., St. Augustine, la. Altemus, William M., Washington, D.C. ... Adamshick, Donald R., Columbus, Ohio Adamson, Mrs. Frances, Fulton, Mo. Adeock, Mrs. Mary Nell, Little Rock, Ark. Agatha, Sister Mary, Buffalo, N.Y. Agnes, Sister M. James, C.S.J., Ran- dolph, Mass. ...
Many others agree that these seemingly peripheral variables impact, for better or for worse, directly on programme outcomes (Peters, Baum, & Stephens, 2011) . ... This is true because they frequently operate in high-pressure, constantly changing environments and in large, complex organisations with often enormous numbers of staff and clients (Edler, Adamshick, ...doi:10.17863/cam.23159 fatcat:5h4zcwj2ovgnng27ucb2rjtod4