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Front Matter: Volume 8522
2012
Photomask Technology 2012
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The CID Number appears on each page of the manuscript. The complete citation is used on the first page, and an abbreviated version on subsequent pages. ...
The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. ...
Patil, SoftJin Technologies Pvt. Ltd. (India) 8522 1Z RDMS: a Windows and tablet PC based reticle defect search database with AHDC for interconnected mask and wafer fabs [8522-71] S. Munir, G. ...
doi:10.1117/12.2008671
fatcat:kdx6hezvqrd4xjz7l7f5ohmgru
Front Matter: Volume 8552
2012
Semiconductor Lasers and Applications V
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The CID Number appears on each page of the manuscript. The complete citation is used on the first page, and an abbreviated version on subsequent pages. ...
The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. ...
Patil, SoftJin Technologies Pvt. Ltd. (India) 8522 1Z RDMS: a Windows and tablet PC based reticle defect search database with AHDC for interconnected mask and wafer fabs [8522-71] S. Munir, G. ...
doi:10.1117/12.1518468
fatcat:f3k4movpo5cyzihij57xp3bpfy
Table of Contents
2021
2021 IEEE International Interconnect Technology Conference (IITC)
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Invited Speech: On-die interconnect technologies for future technology nodes Mauro Kobrinsky Intel 11:00 am -11:30 am S8-2. ...
Metal Wet Recess Challenges and Solutions for Beyond 7nm Fully Aligned via Integration Corneliu Brown Peethala{1}, Devika Sil{1}, Benjamin Briggs{1}, David Rath{1}, Nick Lanzillo{1}, Kedari Matam{1}, Hosadurga ...
doi:10.1109/iitc51362.2021.9537562
fatcat:weqz7hy4svah5hwuhdd5iflkcu
State-of-the-Art and Trends for Computing and Interconnect Network Solutions for HPC and AI
2021
Zenodo
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The present report provides a consolidated view on the current and mid-term technologies (2019-2022+) for two important components of an HPC/AI system: computing (general purpose processor and accelerators ...
) and interconnect capabilities and provides an outlook on future trends in terms of mid-term projections about what users may expect in the coming years. ...
Acknowledgements This work was financially supported by the PRACE project funded in part by the EU's Horizon 2020 Research and Innovation programme (2014-2020) under grant agreement 823767. ...
doi:10.5281/zenodo.5717283
fatcat:irgzrdxr6ncijcfxsdb3sdodii
State-of-the-Art and Trends for Computing and Interconnect Network Solutions for HPC and AI
2021
Zenodo
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The present report provides a consolidated view on the current and mid-term technologies (2019-2022+) for two important components of an HPC/AI system: computing (general purpose processor and accelerators ...
) and interconnect capabilities and provides an outlook on future trends in terms of mid-term projections about what users may expect in the coming years. ...
Acknowledgements This work was financially supported by the PRACE project funded in part by the EU's Horizon 2020 Research and Innovation programme (2014-2020) under grant agreement 823767. ...
doi:10.5281/zenodo.5534079
fatcat:fdknu7w4mfc5foa4gnmt5vqdna
Design for manufacturability and reliability in extreme-scaling VLSI
2016
Science China Information Sciences
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Keywords design for manufacturability, design for reliability, VLSI CAD Citation Yu B, Xu X Q, Roy S, et al. Design for manufacturability and reliability in extreme-scaling VLSI. ...
and targeting for research and development. ...
The authors would like to thank Meng LI and Wei YE at University of Texas for helpful comments.
Conflict of interest The authors declare that they have no conflict of interest. ...
doi:10.1007/s11432-016-5560-6
fatcat:lz5ebjqeprbanbkgxqxjeouip4
Performace modeling and optimization for on-chip interconnects in memory arrays
2015
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)
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beyond-2020 technology generations. ...
Using
111 In addition to the the memory and interconnect technologies covered in this work, some of the emerging device and interconnect technologies pursued in order to extend Moore's law to beyond ...
doi:10.1109/epeps.2015.7347150
fatcat:wlqdssnf7vbhzilesre4rzybba
Future HPC Technologies
2020
Zenodo
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The three main HPC ecosystems beside Europe, namely US, China and Japan have undertaken significant research initiatives to work on these new approaches. ...
The last section presents some recommendations for Europe to strengthen its position in technologies relevant for future HPC system. ...
Extreme ultraviolet lithography -EUV or EUVL), and the power density of those technologies is still not known, perhaps limiting the number of devices active at the same moment on the die. ...
doi:10.5281/zenodo.4106742
fatcat:ybxhgen7nzet7i7bubwou2u55a
D3.4 Intermediate COREnect Industry Roadmap
[article]
2022
Zenodo
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One of the key COREnect objectives is to define a strategic R&I roadmap for future European connectivity systems and components, supporting Europe's strategic autonomy and sovereignty objectives. ...
This roadmap is being defined based on input from all relevant stakeholders across different domains and communities (including SNS and KDT), covering the relevant actors from industry, research, academia ...
Similarly, the technology used by ASML for its flagship EUV lithography started in the 1980s on the use of soft x-rays. ...
doi:10.5281/zenodo.5863480
fatcat:fvr57ujos5f2la2trwdtfurlb4
Eurolab-4-HPC Long-Term Vision on High-Performance Computing
[article]
2018
arXiv
pre-print
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Because of the long-term perspective and its speculative nature, the authors started with an assessment of future computing technologies that could influence HPC hardware and software. ...
The proposal on research topics is derived from the report and discussions within the road mapping expert group. ...
GlobalFoundries Updates Roadmap: 7 nm in 2H 2018, EUV Sooner Than Later?: http://www.anandtech.com/ show/10704/globalfoundries-updates-roadmap-7nm-in-2h-2018.
[ 9 ] 9 N. Hemsoth. ...
arXiv:1807.04521v1
fatcat:5neetrgubjhnvcajcktpkohrzq
COREnect D3.3. Initial COREnect industry roadmap
[article]
2021
Zenodo
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Similarly, the technology used by ASML for its flagship EUV lithography started in the 1980s on the use of soft x-rays. ...
intruding into this market for 5G and beyond looks very difficult on the short and midterm. ...
Appendix The COREnect roadmap activities strongly rely on interactions with experts in the field. ...
doi:10.5281/zenodo.5075317
fatcat:ww7icphzfjcdjlxbsbo2qekghy
Panel: Looking Backwards and Forwards
2016
Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
unpublished
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What is EDA doing and, more important, what should EDA do -and is not doing -in order for the next decade to be as great as the past one? ...
Also thanks to EDA, tools, methodologies, and flows that were originally devised for design enablement for the emerging technology nodes, have been successfully redeployed at the established technology ...
On the technical side, we are already deep into the development phase for 7nm and can see a reasonable path to 5nm. The need is there. ...
doi:10.3850/9783981537079_0976
fatcat:ftim4buq2fdffdnav7za7ap57q
Scaling Moore's Wall: Existing Institutions and the End of a Technology Paradigm
2018
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This study first provides theoretical and historical context for the phenomenon under consideration. ...
For nearly 60 years, semiconductor technology has been defined by rapid rates of progress and concomitant decreases in costs-perfunction made possible by the extendibility of the silicon integrated-circuit ...
Acknowledgements The journey to completing and submitting a dissertation has been far different than what I originally envisioned. ...
doi:10.1184/r1/6721397.v1
fatcat:iorsmrvbkfaspjghhqvcojwo5q
Metallic nanotransistors
[article]
2009
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In the fabrication, the minimum achievable line widths is mainly determined by the surface charging effects due to the direct EBL patterning on insulating substrates and by proximity effects for having ...
Metallic nanowire devices were deposited on insulating substrates such as Si₃N₄ or SiO₂ to facilitate electrical characterisation and device operation. ...
, extreme ultraviolet lithography [30] (EUV), and multiple beam lithography [31] . ...
doi:10.26021/2433
fatcat:5dsw76iz5zbqzlvtbwdzmblfjm
an ion beam complement to electron beam writers
2012
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In our experiments we have exploited also additional ion-matter interactions to the two current main stream ones (sputtering and gas assisted processing). ...
For example employing 40 keV Ga ions, we have analysed two applications in more detail: We exposed a 6 nm thin hydrogen silsesquioxane (HSQ) resist and reached a line-width thinner than 10 nm as well as ...
However, the future of focused ion beam technology in nano patterning will depend on profound theory beyond conventional analysis and micro patterning applications. ...
doi:10.17877/de290r-14294
fatcat:cugxlek5xrhjvg65uuwpnzk2m4
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