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2021
2021 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)
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Driver Assistance Systems D11-3 Opportunity and Challenge of Chiplet-Based HPC and AIoT D1-4 An 8-Bit 1.25-GS/s 2.5-GHz ERBW Folding-Subrange ADC with Power-Efficient
Metastability Error Reduction Technique ...
Everywhere: The Challenges and Opportunities for Semiconductor Designs D10-3 A TinyMLaaS Ecosystem for Machine Learning in IoT: Overview and Research Challenges Session D11: Industrial Session -Parallel ...
doi:10.1109/vlsi-dat52063.2021.9427313
fatcat:dahcwqnflndbdb4o3hc2g6b7gu
[Front matter]
2022
2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)
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Chow of IBM, USA. The third keynote address is "EDA Opportunities for Future HPC and 3D IC Integration" by Ken Wang of TSMC, Taiwan. ...
Techniques for CAD Tool Parameter Auto-tuning in Physical Synthesis: A Survey •••••••••••••••• Application of Deep Learning in Back-End Simulation: Challenges and Opportunities ••••••••••• EasyMAC: Design ...
Keynote III "EDA Opportunities for Future HPC and 3D IC Integration" Ken Wang (TSMC, Taiwan) In the AI era of computing, it is opening lots of opportunities for semiconductor and EDA industries. ...
doi:10.1109/asp-dac52403.2022.9712529
fatcat:grhcgyrcqzhxrlkzgzo2ai75u4