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Finite Element Approach of Unshielded Multiconductor Transmission Lines Embedded in Layered Dielectric Region for VLSI Circuits

Sarhan M. Musa, Matthew N. O. Sadiku
2012 International Journal of Computing and Digital Systems  
This paper presents the quasi-TEM approach for the analysis of unshielded multiconductor transmission lines interconnect in single and two-layered dielectric region using the finite element method (FEM  ...  We mainly focus on designing of four-transmission lines embedded in two-layered dielectric media and five-transmission lines interconnect in single-layered dielectric medium.  ...  THEORY FOR THE PROBLEM FORMULATION OF International Journal of Computing and Digital Systems --An International Journal @ 2012 UOB CSP, University of Bahrain MULTICONDUCTOR INTERCONNECTS IN MULTILAYERED  ... 
doi:10.12785/ijcds/010104 fatcat:tnlia4hgtnfopbembsh77nc6di

Interconnect Modeling Using the Quasi Monte Carlo Integration Technique

Shradha Shekhar, Ankhuri Dubey, Mrinal Mishra, Nisha Gupta
2012 Advanced Computational Techniques in Electromagnetics  
As an example, the interconnects are modeled as parallel plate, cylindrical, and spherical capacitors separated by some distance and multilayered and multiconductor interconnects.  ...  The methodology is based on Quasi Monte Carlo integration technique applied to method of moments solution of integral equation.  ...  Example 2: capacitance of two isolated cylinders. Example 3: capacitance of two isolated spheres. Example 4: Capacitance of multilayered and multiconductor interconnects.  ... 
doi:10.5899/2012/acte-00112 fatcat:v3pa66ki2ff3hfwwk3pe764ree

A novel transient simulation for 3D multilevel interconnections on complex topography

Hsin-Ming Hou, Chin-Shown Sheen, Ching-Yuan Wu
1999 IEEE Transactions on Electron Devices  
An efficient method is presented to model the transient characteristics of distributed resistor-capacitor of ULSI multilevel interconnections on complex topography, in which the reformulation of the boundary-element  ...  Hence, it is easy to calculate the transient characteristics of both parallel conductors and complicated configurations such as crossing lines, corners, contacts, multilayers, and their combinations.  ...  Actually, when the pumping charges are driven to one end of conductor, according to the image charges induced by the multiconductors on multilayer topography we adopted, the coupling capacitance of interconnections  ... 
doi:10.1109/16.753702 fatcat:g5autkzcyne6hfa6nzjqssytru

A high frequency model based on the physical structure of the ceramic multilayer capacitor

L.C.N. de Vreede, M. de Kok, C. van Dam, J.L. Tauritz
1992 IEEE transactions on microwave theory and techniques  
In this paper modelling of the high frequency behavior of ceramic multilayer capacitors based on device physics is presented.  ...  This model is suitable for use in the design and development of improved high frequency CMC structures.  ...  In order to reduce computing time only one half of the cross section has been used. PISCES calculates the capacitance matrix as well as equipotential lines.  ... 
doi:10.1109/22.146342 fatcat:msq5jwnu2fc5tcxscujcqkqbqe

A novel modeling technique for efficiently computing 3-D capacitances of VLSI multilevel interconnections-BFEM

Hsin-Ming Hou, Chin-Shown Sheen, Ching-Yuan Wu
1998 IEEE Transactions on Electron Devices  
An efficient method is presented to model the parasitic three-dimensional (3-D) capacitance of VLSI multilevel interconnections.  ...  Based on the boundary-finite-element method (BFEM) of integral formulation, arbitrary triangle elements on the surface of conductors for charge distribution are used to efficiently calculate capacitances  ...  Most of them treat the two-dimensional (2-D) problems, in which infinite parallel conductors are considered [3] , [4] , [14] .  ... 
doi:10.1109/16.658831 fatcat:6r2un6lt5vcjvoztkrj545sgom

Computation of Conductance and Capacitance for IC Interconnects on a General Lossy Multilayer Substrate

H. Ymeri, B. Nauwelaers, Karen Maex
2001 Active and Passive Electronic Components  
The transmission line parameters (capacitance and conductance per unit length) for the given interconnect multilayer geometry are computed.  ...  In this paper a simple method for analysis and modelling of transmission interconnect lines on general lossy multilayer substrates at high bit rates is presented.  ...  The proposed method is very convenient to implement since the two-dimensional problem is reduced to a one-dimensional series for dielectric-dielectric interfaces while expressions are fully analytical  ... 
doi:10.1155/2001/87589 fatcat:mov34qt3ivbt7bdsudtnrxoxpq


Teng-Kai Chen, Gregory H. Huff
2013 Progress In Electromagnetics Research M  
The results are important especially for highly demand on miniaturization of circuit design to place multiple CPWs in parallel.  ...  The analysis yields a closed-form expression based on the quasi-TEM assumption and conformal mapping transformation.  ...  However, the demands on designing high-speed circuits and systems with the increase of integration density have led to multiconductor interconnects [6] .  ... 
doi:10.2528/pierm13032110 fatcat:wkhyq3e2qrbupfzekacpfeqbrm

Neural characterization of wire bundles multiconductor transmission lines

B. Cannas, A. Fanni, F. Maradei
2002 IEEE transactions on magnetics  
The procedure allows a fast characterization of the nonuniform bundles multiconductor transmission lines.  ...  A neural network approach is proposed for the characterization of twisted wire bundles multiconductor transmission lines.  ...  ACKNOWLEDGMENT The authors would like to thank Dr. P. Testoni for his generous help.  ... 
doi:10.1109/20.996203 fatcat:7v6bbz6hhnfjnd5wovg7k5nc24

An efficient integral method for capacitance extraction of multiconductor microstrip lines

Amel Boudriga Tounsi, Khaled Grayaa, Taoufik Aguili
2007 International Journal of Multiphysics  
The capacitance matrix of two and eight transmission lines has been successfully calculated by using our approach.  ...  This approach evaluates directly the accurate determination of capacitance matrix characterised by variational form.  ...  A key step to optimize electrical performance of the integrated circuits is the extraction of the self and coupling capacitances of multilayer and multiconductor interconnects.  ... 
doi:10.1260/175095407782219210 fatcat:ycs5b35ajjb5reqwhfkurjojfi

Comparative radio‐frequency and crosstalk analysis of carbon‐based nano‐interconnects

Manjit Kaur, Neena Gupta, Sanjeev Kumar, Balwinder Raj, Arun K. Singh
2021 IET Circuits, Devices & Systems  
A comparative radio-frequency (RF) and crosstalk analysis is performed on carbon nanointerconnects based on an efficient π-type equivalent single-conductor model of bundled multiwall carbon nanotubes (  ...  MWCNTs) and stacked multilayer graphene nanoribbons (MLGNRs).  ...  However, the scope of results is confined to one or two parameters in most cases and only for local-and intermediate-level interconnects.  ... 
doi:10.1049/cds2.12044 fatcat:73btrbl2m5bvldsazt6g7x2gxy


Ahmad Cheldavi, Ali Arshadi
2006 Electromagnetic Waves  
Finally the s-parameters of this equivalent circuit compared with the results of full wave simulations. The results show good agreement up to some GHz.  ...  In the present paper a simple model has been given to simulate the signal propagation through cross orthogonal coupled strip lines in multilayer PCB board.  ...  Multilayer boards usually designed in such a way that interconnects of one layer are orthogonal with interconnects on the two adjacent layers.  ... 
doi:10.2528/pier05083101 fatcat:5d4enkzepvfdnpgivakno6ep3u


El Mokhtar Hamham
2016 Progress In Electromagnetics Research M  
The propagation characteristics and attenuation of multimode symmetrical multiconductor system are obtained.  ...  The effectiveness of the applied approach is confirmed by comparison of the computed numerical results with those obtained by full-wave simulators. They are found to be in good agreement.  ...  NUMERICAL RESULTS AND DISCUSSION Therefore, in this work, we focus on the accurate computation of the capacitance p.u.l. and the complex inductance p.u.l. matrices of multiconductor transmission lines  ... 
doi:10.2528/pierm16070203 fatcat:qzq7qpux5jfivhiypuueveuhvm

Capacitance Extraction [chapter]

Wenjian Yu, Zeyi Wang
2005 Encyclopedia of RF and Microwave Engineering  
Acknowledgment The authors would like to thank Prof. W. Hong, Southeast University, Nanjing, China, for much helpful advice. BIBLIOGRAPHY  ...  With the increased circuit density, the multiconductor line in multilayered dielectric media has become the major form of the transmission line or interconnect.  ...  METHODOLOGY AND ALGORITHMS With the advances in IC technology, the methodology of capacitance extraction has evolved from one-dimensional (1D), two-dimensional (2D), 2.5-dimensional (2.5D), to SiN SiO  ... 
doi:10.1002/0471654507.eme573 fatcat:lvsxyydm7vcm7pcm4y2o5vembe

Capacitance Extraction of Three-Dimensional Interconnects Using Element-by-Element Finite Element Method (EBE-FEM) and Preconditioned Conjugate Gradient (PCG) Technique

J. XU, H. LI, W.-Y. YIN, J. MAO, L.-W. LI
2007 IEICE transactions on electronics  
CPU time required, as compared to the results obtained by using the commercial FEM software of either MAXWELL 3D or ANSYS. key words: three-dimensional interconnects (3DIs), capacitance extraction, element-by-element  ...  The element-by-element finite element method (EBE-FEM) combined with the preconditioned conjugate gradient (PCG) technique is employed in this paper to calculate the coupling capacitances of multi-level  ...  Acknowledgments This work was partially supported by the CKSP Research  ... 
doi:10.1093/ietele/e90-c.1.179 fatcat:lv3tzjx6znaitp5nc52af6ppxa

Capacitance study of integrated circuits matrix interconnects

Ahcene Lakhlef, Arezki Benfdila, Lounas Belhimer
2021 Indonesian Journal of Electrical Engineering and Computer Science  
The present work deals with the analysis of capacitance of a multilayer conductor interconnect aiming for their possible exact extraction.  ...  We used three topologies of a microstrip conductor interconnects and identified the potential distributor and then computed the capacitance and inductance matrix using a finite element method.  ...  geometry of the interconnection track on the values of parasitic capacitance.  ... 
doi:10.11591/ijeecs.v22.i2.pp1156-1164 fatcat:qfw7ov5ly5d4peu5hm6y5ikizu
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