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On the layering problem of multilayer PWB wiring [chapter]

S. Tsukiyama, E. S. Kuh, I. Shirakawa
1981 Lecture Notes in Computer Science  
This paper deals with the layering problem of multilayer PWB wiring, associated with single-row routing.  ...  Then, a heuristic algorithm is proposed for this problem. i. t .... the interconnections on a single-row into the portions of each layer, and [Single-Row, Single-LaYer Routing]; to lay out wire pattern  ...  Concluding Remarks In this paper, we have described an approach to the layering problem in multilayer PWB wiring.  ... 
doi:10.1007/3-540-10704-5_3 fatcat:p352djm2c5dldp3cf2vrnfkhwi

Optimal Dummy Pattern Design Method for PWB Warpage Control Using the Human-Based Genetic Algorithm

Sun Kyoung Kim, Sang-Hyuk Lee
2020 Micromachines  
The warpage is numerically simulated based on direct modeling of the as-is PWB patterns to evaluate the warpage alongside the dummy pattern design set.  ...  In this work, a method that minimizes printed wiring board (PWB) warpage by dummy pattern design is proposed.  ...  Conflicts of Interest: The authors declare no conflict of interest.  ... 
doi:10.3390/mi11090807 pmid:32854354 pmcid:PMC7569826 fatcat:6mcmd3pszbgvln7mdkexcyfhfi

Suppression of Noise Propagation between Power and Ground Planes Using Ferrite-Plated EBG Structure

K. Kondo, S. Yoshida, Y. Toyota
2014 Journal of the Japan Society of Powder and Powder Metallurgy  
To confirm the feasibility of suppressing electromagnetic interference (EMI) in the inner layers of multilayered printed wiring boards (PWBs) and sustaining power integrity characteristics, influence of  ...  inserting a ferrite-plated thin film between the power and ground planes on the transmission characteristics were evaluated using four types of test boards with the following two conditions: one is the  ...  Watanabe at the Industrial Technology Center of Okayama Prefecture for his contribution to the fabrication of the test boards.  ... 
doi:10.2497/jjspm.61.s299 fatcat:ctjpjfecirfl5pqc23duxgdz54

Active cooling substrates for thermal management of microelectronics

Yong Wang, Guang Yuan, Yong-Kyu Yoon, M.G. Allen, S.A. Bidstrup
2005 IEEE transactions on components and packaging technologies  
The fluid control unit, a synthetic jet, has been implemented in an epoxy-glass printed wiring board by multilayer lamination. An air reservoir is drilled through the core of printed wiring board.  ...  Heat removal in printed wiring boards (PWB) is primarily accomplished through conduction.  ...  ACKNOWLEDGMENT The authors would like to thank Dr. A. Glezer and his Research Group at Georgia Tech for their assistance with experimental data collection.  ... 
doi:10.1109/tcapt.2005.848575 fatcat:6dyfozltfrbqrkol2eju6tizxy

Permanent Interconnection Technology

D. S. Campbell, D. Boswell
1980 ElectroComponent Science and Technology  
Within permanent interconnection technology two-thirds of the Output at Sales Value is associated with PWBs and one-third with thick/thin film circuits.Research Work in the field is discussed and a division  ...  This paper is concerned with the permanent connection of electronic components into sub-systems and is based on the report of an ERC Working Party that investigated the subject during 1978 and 1979.  ...  Naturally, in any reporting of this nature, there is an inevitable bias due to the views of the authors who must be held responsible for the contents of this paper. Thick film 1:1.7 Thin f'tim 1:2  ... 
doi:10.1155/apec.7.3 fatcat:csjdy2vcq5faxkcxeurub5dp4y

Page 944 of American Ceramic Society Bulletin Vol. 61, Issue 9 [page]

1982 American Ceramic Society Bulletin  
It is fabricated as a three-layer multilayer board for surface attachment or as a metal-core PWB for PTH attachment.  ...  New performance requirements have encourag- ed the development of beryllia for the cofired multilayer system.  ... 

The Path to Successful Production

1985 IEEE Design & Test of Computers  
Digital Equipment Corporation's Tim Moore and Stephen Garner examine the problem of automatically probing printed wiring boards on a modern dynamic high speed functional tester.  ...  Customers con-they are put on chips, they must still be interconnected and that vehicle remains the PWB. But both the PWB and the VLSI chip are in themselves marvels ofthe electronics age.  ... 
doi:10.1109/mdt.1985.294792 fatcat:b7beewi6kjcofgycfbnuifzaaa

Data-Mining of Factors Affecting Circuit Connection Reliability on Laser-Drilled Micro Blind via Holes in Multi-Layer PWBs

Keiji OGAWA, Toshiki HIROGAKI, Eiichi AOYAMA, Shinji MAEDA, Hisahiro INOUE, Tsutao KATAYAMA
2006 JSME international journal. Series A, Solid mechanics and material engineering  
The purpose of the present study is to analyze the circuit connection reliability of printed wiring boards (PWBs) in relation to the thermal stresses obtained by FEM and to apply the FEM data to a data-mining  ...  method in order to clarify the factors that influence the thermal stress of the copper plating on the drilled hole walls.  ...  However, a problem has emerged in that the strength of the substrate is sometimes insufficient because the insulating resin layers are used as multilayers.  ... 
doi:10.1299/jsmea.49.522 fatcat:s2eiijmqjvdovpripmsicdr7ty

An alternative for reducing the layers in the construction of three-phase planar transformers

R. Prieto, R. Asensi, O. Garcia, J. A. Cobos, F. Jerez, F. Gerez
2012 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC)  
One of the key factors that might increase the cost and complexity in the construction of planar transformers is the number of layers of each PCB winding.  ...  This issue becomes even more important in medium-high power three-phase transformers, where the number of PCB layers is higher.  ...  Depending on the copper thickness, number of layers is varying from ten to sixteen. If needed more layers a multilayer stack of two or more multilayer PWBs should be placed.  ... 
doi:10.1109/apec.2012.6165944 fatcat:x7zrn6ak5zf4rc6c4m2wdqt6we

Analyzing packaging trade-offs during system design

P.A. Sandborn, M. Vertal
1998 IEEE Design & Test of Computers  
The authors discuss the role of packaging costs in system design and present examples highlighting packaging design trade-offs.  ...  When using PIR, the fabricator leaves the photoresist used in patterning the internal layers on top of the copper circuits after development and etching of the layer pairs.  ...  In our first example, we must construct a data accumulator/storage module using a combination of wire-bonded bare dies, packaged chips, and discrete components mounted on both sides of a PWB.  ... 
doi:10.1109/54.706028 fatcat:ttbzbwt7cjbupovctntiyfyt4m

Modeling of Cu Direct Laser Drilling Process

Junichi Okada
2012 Journal of Laser Micro/Nanoengineering  
Drilling of printed wiring boards (PWBs) by CO2 laser radiation was studied both experimentally and theoretically.  ...  These results show that as a result of thermal decomposition, resin's internal pressure increases rapidly and the pressure pushes upward the liquid Cu foil in the upper layer.  ...  In a multistratified PWB, a via hole is processed to connect the upper layer with the lower layer by using wired connections. To drill this hole, high-speed processing is required.  ... 
doi:10.2961/jlmn.2012.03.0024 fatcat:vfolsteoffdz3fhutl75fiopfe

Parametric reliability analysis of no-underfill flip chip package

Kuo-Ning Chiang, Zheng-Nan Liu, Chih-Tang Peng
2001 IEEE transactions on components and packaging technologies  
This research proposes a structure using a ceramic-like material with CTE close to silicon, mounted on the backside of the substrate to constrain the thermal expansion of the organic substrate.  ...  The results show that this constraint-layer structure could make the solder joints of the package achieve the same range of reliability as the conventional underfill material.  ...  The package is mounted on a multilayer FR-4 printed wiring board (PWB). On the BGA side, Table I .  ... 
doi:10.1109/6144.974953 fatcat:gqhq65kjdzelzod6lvtridkoma

A unified design methodology for CMOS tapered buffers

1996 Microelectronics and reliability  
A multilayer telecommunications module was fabricated to demonstrate the feasibility of this MCM-LD concept.  ...  Placing buffers evenly (locally or globally) over the plane at the minimum impact on wire length increase helps avoiding buffer congestion and results in less crosstalk between clock wires.  ... 
doi:10.1016/0026-2714(96)84487-8 fatcat:dclogwldjfei3hs62qdhriz2xq

The effect of flux chemistry, applied voltage, conductor spacing, and temperature on conductive anodic filament formation

W. J. Ready, L. J. Turbini
2002 Journal of Electronic Materials  
Quantification of the effect of each variable was determined through a series of accelerated life tests (ALTs), with each ALT consisting of 32 printed wiring boards (PWBs).  ...  This study quantified the effect of flux chemistry, applied voltage (V), spacing (L), and temperature on the failure rate.  ...  The four cathodic test sites on each PWB (PTHs on right in Fig. 6 ) were "ganged" together with a connecting wire so that a failure at any single site would register as a failure for the entire PWB.  ... 
doi:10.1007/s11664-002-0012-z fatcat:5cxt3ass4nbqxhhgfrjukpzgze

Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards

C. Hillman, K. Rogers, A. Dasgupta, M. Pecht, R. Dusek, B. Lorence
1999 Circuit world  
This paper presents the defects that occur during the assembly and manufacturing of solder joints in single-sided insertion-mount printed wiring boards (PWBs).  ...  Each type of defect is discussed, with particular focus on how these defects are related to solderability issues, the mechanisms of failure due to defect-induced failure accelerators, and the effect of  ...  Acknowledgements The authors would like to acknowledge the finite element studies designed by K. Darbha, K. Upadhyayula, and J. Song.  ... 
doi:10.1108/03056129910269025 fatcat:ktmveyamdbhqzcqr5er4ik6kqu
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