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2019 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 9

2019 IEEE Transactions on Components, Packaging, and Manufacturing Technology  
Raj, A., +, TCPMT June 2019 1082-1093 Light emitting diodes A Comparative Study for the Junction Temperature of Green Light-Emitting Diodes.  ...  ., +, TCPMT Aug. 2019 1526-1534 Lenses A Comparative Study for the Junction Temperature of Green Light-Emitting Diodes.  ... 
doi:10.1109/tcpmt.2019.2958004 fatcat:ch5qmieiofeplgdtjb43gqpx34

2020 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 10

2020 IEEE Transactions on Components, Packaging, and Manufacturing Technology  
., +, TCPMT April 2020 551-558 Lighting Detailed Study of Optical and Thermal Performance for White Light-Emit- ting Diodes With Filament-Like Packaging Structures.  ...  Monte, A., +, TCPMT March 2020 479-486 Improved Light Extraction of Nitride-Based Light-Emitting Diodes by Al 2 O 3 -Doped UV-Curing Encapsulant.  ...  Random forests A Predictive Abnormality Detection Model Using Ensemble Learning in Stencil Printing Process. Alelaumi, S., +, 1560 -1568  ... 
doi:10.1109/tcpmt.2020.3045544 fatcat:cpw36cbjcvernfgyphvprvtsvy

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Miao Cai, Peng Cui, Yikang Qin, Daoshuang Geng, Qiqin Wei, Xiyou Wang, Daoguo Yang, Guoqi Zhang
2020 Entropy  
Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime.  ...  Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis  ...  Thermal modeling is useful in analyzing the heat transfer performance of light-emitting diodes (LEDs) [2, 3] and insulated-gate bipolar transistors [4] as it reveals junction temperature, thermal conductivity  ... 
doi:10.3390/e22020254 pmid:33286028 pmcid:PMC7516701 fatcat:jujjek3yozdlhpfuwluwqybd2q

Joining Technology Innovations at the Macro, Micro, and Nano Levels

Anming Hu, Jolanta Janczak-Rusch, Tomokazu Sano
2019 Applied Sciences  
With the growing joining requirements of emergent engineering materials and new applications, conventional welding continues to evolve at all scales spanning from the macro- down to the micro- and nanoscale  ...  This special issue may provide a relatively full picture of the state-of-the-art research progress, fundamental understanding, and promising application of modern joining technologies.  ...  Acknowledgments: The authors thank Ben Nielsen and Denzel Bridges for revision and editing. Conflicts of Interest: The authors declare no conflicts of interest.  ... 
doi:10.3390/app9173568 fatcat:khe3f2i3lnh4lepxszhkdkedv4

Bulk Polycrystalline Ceria Doped Al_2O_3 and YAG Ceramics for High-Power Density Laser-Driven Solid-State White Lighting: Effects of Crystallinity and Extreme Temperatures [article]

E. H. Penilla, P. Sellappan, M.A. Duarte, A.T. Wieg, M. Wingert, and J. E. Garay
2019 arXiv   pre-print
in UV light emitting devices (LED) and laser diodes (LD).  ...  These broadband phosphors can be used in the commonly employed scheme of mixing with other UV converting capping layers that emit red light to produce white light.  ...  Acknowledgements: We gratefully acknowledge the funding of this work by a multidisciplinary research initiative (MRI) from the High Energy Lasers-Joint Technology Office (HEL-JTO) and the Office of Naval  ... 
arXiv:1912.10393v1 fatcat:2hd4rbfvtvfknmu6bzrancdg7q

Hybrid integration of light-emitters and detectors with SOI-based micro-opto-electro-mechanical systems (MOEMS)

Joel A. Kubby, Jim Calamita, Jen-Tsorng Chang, Jingkuang Chen, Peter Gulvin, C.-C. Lin, Robert Lofthus, Bill Nowak, Yi Su, Alex Tran, David Burns, Janusz Bryzek (+22 others)
2001 Silicon-based and Hybrid Optoelectronics III  
These shortcomings include the controllability and uniformity of material stress that is a major cause of curvature and deformation in released microstructures.  ...  Flip-chip bonding techniques are also being developed for the hybrid integration of edge and surface emitting lasers on the front and back surfaces of the silicon wafer, adding to the functionality and  ...  Blessing and Phillip Perconti.  ... 
doi:10.1117/12.426941 fatcat:ifdxu347abf5lnzk7qvtczdivm

Inorganic Semiconductors for Light-emitting Diodes [chapter]

E. Fred Schubert, Thomas Gessmann, Jong Kyu Kim
2006 Organic Light Emitting Devices  
During the past 40 years, light-emitting diodes (LEDs) have undergone a significant development.  ...  This requirement has led to the development of heterojunction LEDs consisting of different semiconductor alloys and multiple quantum wells embedded in the light-emitting active region.  ...  for Light-emitting Diodes 1 Inorganic Semiconductors for Light-emitting Diodes  ... 
doi:10.1002/3527607986.ch1 fatcat:lhchjhaus5eg5gfq3luqwpsnga

Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

Eric J. Schneller, R. Paul Brooker, Narendra S. Shiradkar, Marianne P. Rodgers, Neelkanth G. Dhere, Kristopher O. Davis, Hubert P. Seigneur, Nahid Mohajeri, John Wohlgemuth, Giuseppe Scardera, Andrew C. Rudack, Winston V. Schoenfeld
2016 Renewable & Sustainable Energy Reviews  
Additionally, a gap analysis is carried out to identify areas in need of further research and a discussion is provided that addresses new challenges for advanced materials and emerging technologies.  ...  The ultimate goal of this article is to identify appropriate metrology techniques and characterization methods that can be utilized within a module manufacturing facility to improve the reliability and  ...  EL images showed the same cell with different halves of the cell emitting light after successive thermal cycling [25] .  ... 
doi:10.1016/j.rser.2015.12.215 fatcat:o5bbmog3dfcbpczmcfjpvlvtkq

Computational Dynamics of Anti-Corrosion Performance of Laser Alloyed Metallic Materials [chapter]

Olawale S. Fatoba, Patricia A.I. Popoola, Sisa L. Pityana, Olanrewaju S. Adesina
2016 Fiber Laser  
It is expected that the melt pool flow, thermal and solidification characteristics will have a profound effect on the microstructure of the solidified region.  ...  Laser surface alloying (LSA) is a material processing technique that utilizes the high power density available from defocused laser beam to melt both reinforcement powders and a part of the underlying  ...  CO 2 lasers emit light with a wavelength of 10.6 µm with an overall efficiency of 10-13%. Regardless of the low efficiency, the CO 2 lasers have a good beam quality and focusability.  ... 
doi:10.5772/62334 fatcat:kcksku72sjacdasygm6cjbckja

Materials development and potential applications of transparent ceramics: A review

Zhuohao Xiao, Shijin Yu, Yueming Li, Shuangchen Ruan, Ling Bing Kong, Qing Huang, Zhengren Huang, Kun Zhou, Haibin Su, Zhengjun Yao, Wenxiu Que, Yin Liu (+7 others)
2019 Materials science & engineering. R, Reports  
Moreover, the optical transparency of ceramics is determined by their purity and density; the production of high-purity ceramics requires high-purity starting materials, and the production of high-density  ...  and they can be used as host materials for solid-state lasers.  ...  The high-reflection coated face of the microchip was bonded to a water-cooled heat sink with a thermally conductive glue to ensure efficient heat dissipation, and the pump light from a four-fold diode  ... 
doi:10.1016/j.mser.2019.100518 fatcat:dmh52qgqwnebjfrfptuwyzvubi

Phosphor-Free Apple-White LEDs with Embedded Indium-Rich Nanostructures Grown on Strain Relaxed Nano-epitaxy GaN

C. B. Soh, W. Liu, A. M. Yong, S. J. Chua, S. Y. Chow, S. Tripathy, R. J. N. Tan
2010 Nanoscale Research Letters  
Phosphor-free apple-white light emitting diodes have been fabricated using a dual stacked InGaN/ GaN multiple quantum wells comprising of a lower set of long wavelength emitting indium-rich nanostructures  ...  and a period of 250 nm.  ...  The authors are grateful for the funding and also the support by SNFC group in IMRE for the use of characterization/fabrication tools.  ... 
doi:10.1007/s11671-010-9712-0 pmid:21124627 pmcid:PMC2964473 fatcat:cynlordjhfepxns7xaxd4y4eva

Research/Researchers

1994 MRS bulletin  
Using a single electroluminescent material, the team produced miniature light-emitting diodes (LEDs) on glass that generate the three primary optical colors of red, green, and blue.  ...  He also wrote that by forming exciplexes and tweaking the type and spacing of the blending material, engineers will have better control over the color and efficiency of light a material emits.  ...  Vossen A Volume in the PHYSICS OF THIN FILMS Series This latest volume of the well-known Physics of Thin Films Series includes four chapters that discuss high-density plasma sources for materials processing  ... 
doi:10.1557/s088376940004834x fatcat:u5br434arbfx3jvdeug7d55ha4

Using Graphene-Based Grease as a Heat Conduction Material for Hectowatt-Level LEDs: A Natural Convection Experiment

Chih-Neng Hsu, Keng-Wei Lee, Chun-Chih Chen
2021 Processes  
In this study, a self-adjusting concentration of graphene thermal grease was developed to reduce the contact surface thermal resistance of 50 W light-emitting diodes (LEDs).  ...  This material could continuously achieve a completely uniform and rapid thermal diffusion of heat energy.  ...  Conflicts of Interest: The authors declare no conflict of interest.  ... 
doi:10.3390/pr9050847 fatcat:vi6fduymrza3dkzotvkcfxtwie

MRS 1998 Spring Meeting Encompasses Broad Spectrum of Materials Research

1998 MRS bulletin  
in flip-chip bonding for improved thermal management, and 5.5 kV bipolar diodes fabricated from high-quality CVD 4H-SiC.  ...  , characterization, and modeling of electronfield-emitting materials.  ...  High-quality films grown by CVD at low temperature and high silane partial pressures was reported, along with a description of the use of applied strain with photoluminescence to measure the band offsets  ... 
doi:10.1557/s0883769400029134 fatcat:vod5ffr7bfbvdom3zn2bkase2m

3D Printing of Metallic Microstructured Mould Using Selective Laser Melting for Injection Moulding of Plastic Microfluidic Devices

Nan Zhang, Jinghang Liu, Honggang Zhang, Nigel J. Kent, Dermot Diamond, Michael D. Gilchrist
2019 Micromachines  
The dimensional accuracy, surface morphology, bonding strength between the printed patterns and substrate, as well as the microstructure of micro features were all characterized.  ...  The micro metallic patterns are printed on to a pre-finished substrate to form a microstructured mould.  ...  Conflicts of Interest: The authors declare no conflict of interest.  ... 
doi:10.3390/mi10090595 pmid:31510027 pmcid:PMC6780298 fatcat:rend4kalmfagvio7n4tbjbxhvy
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