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Reconfigurable integrated optoelectronics

Richard Soref
2011 2011 ICO International Conference on Information Photonics  
Integrated optics today is based upon chips of Si and InP.  ...  This paper shows that any ROEIC-on-a-chip can be decomposed into photonic modules, some of them fixed and some of them changeable in function.  ...  Riza for his collaboration on the RF beamformer.  ... 
doi:10.1109/ico-ip.2011.5953805 fatcat:jdmbs4ljfrbotlhw5mta42vwpm

Reconfigurable Integrated Optoelectronics

Richard Soref
2011 Advances in OptoElectronics  
Integrated optics today is based upon chips of Si and InP.  ...  This paper shows that any ROEIC-on-a-chip can be decomposed into photonic modules, some of them fixed and some of them changeable in function.  ...  Riza for his collaboration on the RF beamformer.  ... 
doi:10.1155/2011/627802 fatcat:i7u6lb2bxfgj5ldc4mz47qbdaa

Recent progress in 3D integration technology

Mitsumasa Koyanagi
2015 IEICE Electronics Express  
3D integration technology is the key for future LSIs with highperformance, low-power and multi-functionality.  ...  a Si substrate.  ...  The respective chip layers are vertically connected by both optical interconnections (TSPV, through-Si photonic via) and electrical interconnections (TSV, through-Si via).  ... 
doi:10.1587/elex.12.20152001 fatcat:ojinyz42bjh5pbroho4ebdpi3u

3DIC 2019 Authors Index

2019 2019 International 3D Systems Integration Conference (3DIC)  
CNN Accelerators Jubee Tada{2}, Kazuto Takahashi{2}, Ryusuke Egawa{1} {1}Tohoku University, Japan; {2}Yamagata University, Japan 4054 X-ray photon-counting Imager with CdTe/Si-LSI stacking Toru Aoki  ...  and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers Koichi Takemura{2}, Akio Ukita{2}, Yasuhiro Ibusuki{2}, Mitsuru Kurihara{2}, Akihiro Noriki{1}, Takeru Amano{1}, Daisuke  ... 
doi:10.1109/3dic48104.2019.9058781 fatcat:p25aurwofzaexjtsy5qgfayqye

Silicon photonics for telecom and data-com applications

Kiyoshi Asakawa, 1.Associate Program, University of Tsukuba, Tsukuba, Ibaraki 305-8571, Japan. 2.Nanotechnology Innovation Station, National Institute for Materials Science (NIMS), 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan. 3.Biometrics Research Laboratories, NEC Corporation, 1131, Hinode, Abiko, Chiba 270-1198, Japan., Yoshimasa Sugimoto, Shigeru Nakamura
2020 Opto-Electronic Advances  
In practical applications, silicon photonics started with optical interconnect transceivers in the data-com first, and has been now extended to innovative applications such as multi-port optical switches  ...  Constituted of high refractive-index contrast waveguides on silicon-on-insulator (SOI), a variety of integrated photonic passive and active devices have been implemented supported by excellent optical  ...  Keizo Kinoshita of AIO Core for helpful discussions on Si photonics technologies and applications.  ... 
doi:10.29026/oea.2020.200011 fatcat:b7h3cnnkr5bsrlpsdqcd2t25xm

Mirror-based surface optical input/output technology with precise and arbitrary coupling angle for silicon photonic application

Akihiro Noriki, Takeru Amano, Masahiko Mori, Yoichi Sakakibara
2017 Japanese Journal of Applied Physics  
Mirror-based surface optical coupling is an attractive technology for the optical input/output of Si photonics.  ...  Different angular mirrors were integrated into 3 ' 3-µm-square single-mode silicon oxynitride optical waveguides on Si substrates.  ...  A part of this work was conducted at the AIST Nano-Processing Facility, supported by the "Nanotechnology Platform Program" of the Ministry of Education, Culture, Sports, Science and Technology, Japan (  ... 
doi:10.7567/jjap.56.04ch04 fatcat:qghet2zl6bdulmgfxzo5rpmqwi

Program Schedule - October 8, 2019 (Hotel Metropolitan Sendai)

2019 2019 International 3D Systems Integration Conference (3DIC)  
A curved micro-mirror for an optical TSV of Si interposer up to 200-micrometer thickness was integrated on a Si photonics chip and the vertical optical output from the Si waveguide was demonstrated.  ...  Abstract: Chip-scale-packaged Si photonic optical transceiver modules with high density 3dimensional optical and electrical I/O structures have been developed.  ...  This test method is based on a quiescent supply current that is made flow through an interconnect.  ... 
doi:10.1109/3dic48104.2019.9058792 fatcat:6kz54ru5uzdbzeecpentkxprqe

A Hybrid Integrated Light Source on a Silicon Platform Using a Trident Spot-Size Converter

Nobuaki Hatori, Takanori Shimizu, Makoto Okano, Masashige Ishizaka, Tsuyoshi Yamamoto, Yutaka Urino, Masahiko Mori, Takahiro Nakamura, Yasuhiko Arakawa
2014 Journal of Lightwave Technology  
Index Terms-Hybrid integration, inter-chip optical interconnects, light sources on silicon platform, quantum dot laser, silicon optical interposer, silicon photonics, spot-size converter.  ...  This paper reports a hybrid integrated light source fabricated on a Si platform using a spot-size converter (SSC) with a trident Si waveguide.  ...  vergence system in which photodetectors (PDs), optical modulators, and light sources are linked by optical waveguides on a Si substrate, and bare LSI chips are mounted on the substrate by flip-chip bonding  ... 
doi:10.1109/jlt.2014.2304305 fatcat:unvjrusinzgdfp6gm627jw6guq

Device Scaling Considerations for Nanophotonic CMOS Global Interconnects

S. Manipatruni, M. Lipson, I. A. Young
2013 IEEE Journal of Selected Topics in Quantum Electronics  
Using CMOS with integrated nanophotonics as an example platform, we derive the energy/bit, linear and areal bandwidth density of optical interconnects.  ...  We derive the device requirements for sub 100 fJ/cm/bit interconnects including tuning power, serialization-deserialization energy, optical insertion losses, extinction ratio and bit error rates.  ...  Given the rapid progress in CMOS compatible nano-photonics using III-V [10] , Germanium [11] as well as Silicon based [10] [11] [12] [13] [14] [15] [16] platforms, the on-chip adaptability of optical  ... 
doi:10.1109/jstqe.2013.2239262 fatcat:plfeaxw4lzbrtpjbaca7idond4

Advances in terahertz communications accelerated by photonics

Tadao Nagatsuma, Guillaume Ducournau, Cyril C. Renaud
2016 Nature Photonics  
This article reviews a latest trend of THz communications research focusing on how photonics technologies have played a key role in the development of first-age THz communication systems and how they compare  ...  In addition, one cannot ignore attenuation from rainfall 13 .  ...  THz technologies could benefit further if a strong interconnect technology is created to direct the THz wave on chip between different components.  ... 
doi:10.1038/nphoton.2016.65 fatcat:s4dx4an6erafdembu2mkzsknu4

Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications

Bui Thanh Tung, Motohiro Suzuki, Fumiki Kato, Shunsuke Nemoto, Masahiro Aoyagi
2012 Vietnam Journal of Mechanics  
With the obtained results, the proposed bonding approach is capable of being use in electronics-optics heterogeneous integration applications.  ...  Metal cone bump and conductive sloped hollow bonding pad elements are created using micro-machining techniques, on a chip specimen and substrate, respectively.  ...  Part of the fabrication and inspection was conducted at the Nano-Processing Facility (NPF), supported by IBEC Innovation Platform, AIST.  ... 
doi:10.15625/0866-7136/34/4/1760 fatcat:lgff6leafffm3bf5vp2wns3dku

Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2015 Japanese Journal of Applied Physics  
Acknowledgments This work was performed at Micro/Nano-Machining Research and Education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University.  ...  device sizes 16, 17) because functional blocks formed on chips can be interconnected with short TSVs.  ...  devices in a rectangular shape with high length-to-width aspect ratio are promising candidates for ultraparallel and ultrahigh-speed optical data Optical interconnection Optical path for intra-chip  ... 
doi:10.7567/jjap.54.030206 fatcat:siuyf6tuynaifd6zuju2xhrjfu

On-Chip CMOS-MEMS-Based Electroosmotic Flow Micropump Integrated With High-Voltage Generator

Yuki Okamoto, Hiroyuki Ryoson, Koji Fujimoto, Takayuki Ohba, Yoshio Mita
2019 Journal of microelectromechanical systems  
We have proposed a novel on-chip electroosmotic (EOF) micropump integrated with a high-voltage (HV) generator.  ...  The proposed integration technique is reliable and effective, and potentially boosts the practical applications of lab-on-chip devices. [2019-0206] Index Terms-Electroosmotic flow micropump, CMOS-LSI,  ...  Fig. 8 . 8 Process flow of a micro-channel on the on-chip EOF micropump. (a) 10:1 mixture of PDMS and curing agent is poured on the Si mold and it is thermally cured.  ... 
doi:10.1109/jmems.2019.2953290 fatcat:mukz5n33hng2xbg6rh7ujdtpqu

On the Roadmap, Off the Roadmap, Beyond the Roadmap for Lithography

Masaru Sasago
1999 Journal of Photopolymer Science and Technology (Fotoporima Konwakai shi)  
The semiconductor industry, the long period of sustained growth which is, in no small measure due to the optical lithography process, is now faced with a dilemma.  ...  Their work seeks to extend the useful life of optical lithography as well as to foster the development of post-optical lithographic processes.  ...  chip LSI solution; system LSI '.  ... 
doi:10.2494/photopolymer.12.585 fatcat:eoujagpysrerpafylw7p2wqpqm

Towards monolithic integration of germanium light sources on silicon chips

Shinichi Saito, Abdelrahman Zaher Al-Attili, Katsuya Oda, Yasuhiko Ishikawa
2016 Semiconductor Science and Technology  
However, the direct band gap energy is close to the indirect one, and significant engineering efforts are being made to convert Ge into an efficient gain material monolithically integrated on a Si chip  ...  In this article, we will review the engineering challenges of developing Ge light sources fabricated using nano-fabrication technologies compatible with Complementary Metal-Oxide-Semiconductor (CMOS) processes  ...  However, they are not compatible with Si photonic passive devices using a Si WG, since the emitted light from a quantum confined Si nano-structure is blue-shifted compared with the band gap energy of Si  ... 
doi:10.1088/0268-1242/31/4/043002 fatcat:sxkrjympbbe6djp5gfl2zvuk3i
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