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Officers and Committees

1974 12th International Reliability Physics Symposium  
biomeTriC ConferenCe July 16-21, 2006 monTreal, QuebeC 2007 enar sPring meeTings miami, fl 2008 enar sPring meeTings CrysTal CiTy, va fuTure meeTings of The inTernaTional biomeTriC soCieTy  ...  COMPARISON.OF.ESTIMATORS.FOR.AVERAGE.MEDICAL.COSTS.IN.A.MARKOV.MODEL Lin.Liu*,.Michigan.State.University Zhehui.Luo,.Michigan.State.University Joseph.C..Gardiner,.Michigan.State.University 1 Tampa, Florida 2006 inTernaTional  ... 
doi:10.1109/irps.1974.362618 fatcat:dxuxfosduzcbjbqg3kwhvf4upi

Reliability in MEMS Packaging

Tai-ran Hsu
2006 2006 IEEE International Reliability Physics Symposium Proceedings  
Cost effective packaging and robust reliability are two critical factors for successful commercialization of MEMS and microsystems.  ...  This paper will offer an overview of these factors with proposed resolutions to issues relating to the reliability of these products.  ...  ISSUES IN RELIABILITY OF MEMS MEMS devices are made of minute delicate components that are fabricated and packaged using primarily physical-chemical processes.  ... 
doi:10.1109/relphy.2006.251251 fatcat:prqixxe5w5fvpiis5mpntgc6py

Officers and committees

2014 2014 IEEE International Reliability Physics Symposium  
biomeTriC ConferenCe July 16-21, 2006 monTreal, QuebeC 2007 enar sPring meeTings miami, fl 2008 enar sPring meeTings CrysTal CiTy, va fuTure meeTings of The inTernaTional biomeTriC soCieTy  ...  COMPARISON.OF.ESTIMATORS.FOR.AVERAGE.MEDICAL.COSTS.IN.A.MARKOV.MODEL Lin.Liu*,.Michigan.State.University Zhehui.Luo,.Michigan.State.University Joseph.C..Gardiner,.Michigan.State.University 1 Tampa, Florida 2006 inTernaTional  ... 
doi:10.1109/irps.2014.6860570 fatcat:vuyzxvvhkzetbcx2qc6detf5uq

Officers and committees

2015 2015 IEEE International Reliability Physics Symposium  
biomeTriC ConferenCe July 16-21, 2006 monTreal, QuebeC 2007 enar sPring meeTings miami, fl 2008 enar sPring meeTings CrysTal CiTy, va fuTure meeTings of The inTernaTional biomeTriC soCieTy  ...  COMPARISON.OF.ESTIMATORS.FOR.AVERAGE.MEDICAL.COSTS.IN.A.MARKOV.MODEL Lin.Liu*,.Michigan.State.University Zhehui.Luo,.Michigan.State.University Joseph.C..Gardiner,.Michigan.State.University 1 Tampa, Florida 2006 inTernaTional  ... 
doi:10.1109/irps.2015.7112658 fatcat:m5mkenbicfba3af6rcqn67lcz4

Reliability challenges in advance packaging

Subramanian S. Iyer, Adeel Ahmad Bajwa
2018 2018 IEEE International Reliability Physics Symposium (IRPS)  
Index Terms-3D Stacking, Interposers, Fan-out packaging, Silicon Interconnect Fabric (Si-IF), Reliability I.  ...  This paper highlights the packaging related reliability issues in various advanced packaging schemes such as 3-D stacking, interposers, fan-out packaging, and the more recently developed silicon interconnect  ...  For this reason, researchers have proposed partial filling of TSV with Cu, followed by a complete filling with a polymer of appropriate physical properties [3] . Volant et al.  ... 
doi:10.1109/irps.2018.8353592 dblp:conf/irps/IyerB18 fatcat:rals3hv65ralnadtrjd625jryu

IRPS 2020 Index

2020 2020 IEEE International Reliability Physics Symposium (IRPS)  
doi:10.1109/irps45951.2020.9129532 fatcat:xkgkdm7245guzbvsxxyivujy2m

IRPS 2020 Committees

2020 2020 IEEE International Reliability Physics Symposium (IRPS)  
ChairMing-Yi Lee, Macronix Naohito Suzumura, Renesas Stanislav Tyaginov, IMEC Miaomiao Wang, IBM Eilam Yalon, Technion IC Product Reliability Chair Jae-Gyung Ahn, Xilinx Vice-Chair Souhir  ...  Paolo Bernardi, Politecnico di Torino Sandhya Chandrashekhar, Cypress Lin Cong, Nvidia Ming-Han Hsieh, Mediatek Steven Mittl, IBM Richard (Shiguo) Rao, Inphi Daniel Tille, Infineon Memory Reliability  ... 
doi:10.1109/irps45951.2020.9129261 fatcat:o6y6fr6kwffktcne3v6t6ehwoi

Officers and committees

2016 2016 IEEE International Reliability Physics Symposium (IRPS)  
doi:10.1109/irps.2016.7574497 fatcat:ikxx7zhrv5gs5apzfts7qc5r2q

IRPS 2020 Commentary

2020 2020 IEEE International Reliability Physics Symposium (IRPS)  
The Symposium program is expanding beyond the traditional areas of CMOS device, circuit, and systems reliability to include emerging microelectronics reliability topics, with circuit reliability & aging  ...  We look forward to your feedback so that we can continue to keep this symposium a great experience in future years.  ... 
doi:10.1109/irps45951.2020.9128906 fatcat:6nb43ftmdra4tgywjfzjholr3e

Backend low-k TDDB chip reliability simulator

Muhammad Bashir, Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim, Linda Milor
2011 2011 International Reliability Physics Symposium  
Backend low-k time-dependent dielectric breakdown degrades reliability of circuits with Copper metallization.  ...  As chip complexity increases, designers become less aware of the actual physical functioning of their chip.  ...  Similarly, extending the models of the physics of failure to a chip requires the consideration of a myriad of factors.  ... 
doi:10.1109/irps.2011.5784454 fatcat:bes247n4ffb2zjy4oxtpyefxeq

Electromigration Testing of Al-Alloy Films

P. B. Ghate
1981 19th International Reliability Physics Symposium  
Also, as an internal check, two pilots with patterned leads of Al and AI+Cu films on oxidized slices were probed to determine the resistance values of HCSO3 test patterns with nominal dimensions of 60  ...  I loweVer. thle CUt Concentration appears to be fairly' unliforml inl In Sti in mary N corn posit ion aInldV Si, of Al+( ii and A l+('ti+S i fil ins by the thmree di ffer n t methods are internally consistent  ... 
doi:10.1109/irps.1981.363004 fatcat:hpuzs6zljvfshoacacdzaveery

Electronic failures in spacecraft environments

Douglas J. Sheldon
2010 2010 IEEE International Reliability Physics Symposium  
. • Assembly, test, flight and operation of spacecraft remains a highly challenging electronic parts reliability activity.  ... 
doi:10.1109/irps.2010.5488739 fatcat:m7qjnl3dbzgyzkhvqe5h2trjae

Ambient Use-Condition Models for Reliability Assessment

Chen Gu, Robert Kwasnick, Neal Mielke, Eric Monroe, C. Shirley
2006 2006 IEEE International Reliability Physics Symposium Proceedings  
We describe methods of computing reliability acceleration for realistic temperature/humidity use-condition models.  ...  We compare predictions of these models with traditional reliability assessments, and provide useful models to represent the results.  ...  As a result, there is increased interest in knowledge-based reliability assessment [2] which combines models for reliability models and use conditions.  ... 
doi:10.1109/relphy.2006.251232 fatcat:bheazfglu5bqjboz2rtosgt3mu

Reliability issues in MuGFET nanodevices

G. Groeseneken, F. Crupi, A. Shickova, S. Thijs, D. Linten, B. Kaczer, N. Collaert, M. Jurczak
2008 2008 IEEE International Reliability Physics Symposium  
In this paper we review some recent results on reliability of MuGFET nanodevices with different gate stacks, including polycrystalline-Si/SiON as well as deposited metal gate/high-k stacks.  ...  Much less work was published until recently on the reliability of these alternative nanodevices [13] [14] [15] , and consequently there is a lack of understanding of the reliability issues of MuGFET devices  ...  One of the first papers on reliability of MuGFET devices discussed NBTI already [14] .  ... 
doi:10.1109/relphy.2008.4558863 fatcat:g4zh4urlhbbufoaonsvkwssw4e

On Component Reliability and System Reliability for Space Missions

Yuan Chen, Amanda M. Gillespie, Mark W. Monaghan, Michael J. Sampson, Robert F. Hodson
2012 2012 IEEE International Reliability Physics Symposium (IRPS)  
This paper is to address the basics, the limitations and the relationship between component reliability and system reliability through a study of flight computing architectures and related avionics components  ...  Component reliability analysis and system reliability analysis need to be evaluated at the same time, and the limitations of each analysis and the relationship between the two analyses need to be understood  ...  COMPONENT RELIABILITY IMPACT ON SYSTEM RELIABILITY While system reliability analysis is mainly based on statistics, component reliability analysis relies on statistics as well as technology and physics  ... 
doi:10.1109/irps.2012.6241831 fatcat:lowwobkpzrhmjp2diwogkb3tt4
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