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Phase-change memory

Omer Zilberberg, Shlomo Weiss, Sivan Toledo
2013 ACM Computing Surveys  
The designs surveyed in this article include read before write, wear leveling, write cancellation, write pausing, some encryption schemes, and buffer organizations.  ...  It has been researched and developed in the last decade, with researchers providing better architectural designs which address the technology's main challenges-its limited write endurance, potential long  ...  Further improvement to the mechanism could be achieved by an adaptive write cancellation scheme, which sets the cancellation threshold dynamically according to the number of entries in the write queue  ... 
doi:10.1145/2480741.2480746 fatcat:lvyy3ibbuvaszdk3wazh2tiowy

Three-dimensional Integrated Circuits: Design, EDA, and Architecture

Guangyu Sun
2011 Foundations and Trends® in Electronic Design Automation  
offered by 3D technology. 107 7.5 Cost Evaluation for Many-Core Microprocessor Designs 113 7.6 3D IC Testing Cost Analysis 126 7.7 Conclusion 139 8 Challenges for 3D IC Design 141 Acknowledgements 142 References  ...  The emerging three-dimensional (3D) integration technology is one of the promising solutions to overcome the barriers in interconnect scaling, thereby offering an opportunity to continue performance improvements  ...  thermal thresholds.  ... 
doi:10.1561/1000000016 fatcat:usmthkco4rfavmnlvvmmgxolcq