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Phase-change memory
2013
ACM Computing Surveys
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The designs surveyed in this article include read before write, wear leveling, write cancellation, write pausing, some encryption schemes, and buffer organizations. ...
It has been researched and developed in the last decade, with researchers providing better architectural designs which address the technology's main challenges-its limited write endurance, potential long ...
Further improvement to the mechanism could be achieved by an adaptive write cancellation scheme, which sets the cancellation threshold dynamically according to the number of entries in the write queue ...
doi:10.1145/2480741.2480746
fatcat:lvyy3ibbuvaszdk3wazh2tiowy
Three-dimensional Integrated Circuits: Design, EDA, and Architecture
2011
Foundations and Trends® in Electronic Design Automation
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A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2015; you can also visit the original URL.
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offered by 3D technology. 107 7.5 Cost Evaluation for Many-Core Microprocessor Designs 113 7.6 3D IC Testing Cost Analysis 126 7.7 Conclusion 139 8 Challenges for 3D IC Design 141 Acknowledgements 142 References ...
The emerging three-dimensional (3D) integration technology is one of the promising solutions to overcome the barriers in interconnect scaling, thereby offering an opportunity to continue performance improvements ...
thermal thresholds. ...
doi:10.1561/1000000016
fatcat:usmthkco4rfavmnlvvmmgxolcq