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Survey on Fatigue Life Prediction of BGA Solder Joints

Baojun Qiu, Jingang Xiong, Han Wang, Shuai Zhou, Xiuding Yang, Zhengpei Lin, Maolin Liu, Nian Cai
2022 Electronics  
However, due to environmental loads such as vibration and impact during its production and application, defects inevitably emerge in BGA solder joint defects, which will lead to the failure of electronic  ...  This article summarizes the state-of-the-art research on the factors, analysis methods, and models for the fatigue failure of BGA chips.  ...  Conflicts of Interest: The authors declare no conflict of interest.  ... 
doi:10.3390/electronics11040542 fatcat:c4ez2mrg3japfegozqa6miw3t4

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung
2011 Microelectronics and reliability  
The rainflow cycle counting was used to estimate cumulative damages of the critical solder joint.  ...  This paper develops an assessment methodology based on vibration tests and finite element analysis (FEA) to predict the fatigue life of electronic components under random vibration loading.  ...  Acknowledgments This research work was partially supported by Samsung Electronics and IEEC of State University of New York at Binghamton. The authors appreciate the financial support.  ... 
doi:10.1016/j.microrel.2010.10.003 fatcat:4wnmo5znyjat3nckyn4nypuy64

Package Reliability of MEMS Sensors Used in Automotive Under Random Vibration

Y. Liu, B. Sun, Q. Feng
2013 Chemical Engineering Transactions  
Random Vibration analysis has been used to obtain the solder joint maximum equivalent stress of ADXL78.The results show that the MEMS package solder joint is the weakness point in the structure to fatigue  ...  This paper conducts a research on this problem to reveal the reliability and influencing factors of MEMS on board level using finite element modelling and random vibration response simulation method.  ...  Especially, the fatigue failure of MEMS sensors coursed by vibration and thermal cycle is the major failure mode.  ... 
doi:10.3303/cet1333081 doaj:ac15a1d6e0b74d9e922915635b6770b5 fatcat:k54cbkq4uvcj7e5xr6hql5xlnu

Reliability issues of lead-free solder joints in electronic devices

Nan Jiang, Liang Zhang, Zhi-Quan Liu, Lei Sun, Wei-Min Long, Peng He, Ming-Yue Xiong, Meng Zhao
2019 Science and Technology of Advanced Materials  
This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder  ...  Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints.  ...  [81] studied the effects of underfill arrays and non-underfill arrays on the vibration reliability of PBGA solder joints.  ... 
doi:10.1080/14686996.2019.1640072 pmid:31528239 pmcid:PMC6735330 fatcat:s64fuitobzf3rjsluhoep5blj4

Kesan Gelombang Kejutan terhadap Sifat Mikromekanik Sambungan Pateri SAC 0307/ENiG menggunakan Pendekatan Pelekukan Nano

Maria Abu Bakar, Azman Jalar, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, Ariffin Ismail, Norliza Ismail, Emee Marina Salleh, Najib Saedi Ibrahim
2019 Sains Malaysiana  
Micromechanical properties changes were investigated using nanoindentation approach. The solder joints were exposed to shock wave test using different doses of Emulex, 700 g and 1500 g, respectively.  ...  The shock wave has led to the changes in micromechanical properties of the solder joints in terms of softening behaviour i.e. the decreasing of hardness and reduced modulus values.  ...  Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectronics Reliability 91: 213-226.  ... 
doi:10.17576/jsm-2019-4806-15 fatcat:4nwgf445k5b43jmghsusny6uaq

Reliability analysis of lead-free soldering

Akbar Fatehi, Gholamreza Khayyati, Khayyati Fatehi
as: releasing test, bending test, thermal test and vibration test.  ...  In the process of creating regression models, former distributions are done according to previous studies and the Monte Carlo Markov Chain (MCMC) has been used under the WinBUGS environment.  ...  A PBGA test with 256 solder joints with a diameter of 760 μm was used for this bending test. The test was performed using a HZ1 sine wave with different amplitudes of 25, 30, 40, 50 and 60.  ... 

Through-Life Monitoring of the impact of vibration on the reliability of area array packages using Non- Destructive Testing

K Baishya
Since real time vibration on solder joints have not been studied before, the various steps for successful testing, through life monitoring of the solder joints and data analysis will be investigated and  ...  The effect of the relative position and orientation on the reliability of the solder joints and the flip chips in the PCB was also studied. The data collected was analysed using MATLAB.  ...  In 2018, Tong (Tong An, 2018) studied the failure of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature and random cycling.  ... 
doi:10.24377/ljmu.t.00010654 fatcat:zbpcjk7urrcm3eyuwxaw67bp24