171 Hits in 9.1 sec

Ultrasonic Transducers [chapter]

2014 Ultrasonic Technology for Desiccant Regeneration  
Wafer Bonding and Device Packaging Wafer Bonding Techniques Wafer Bonding and Device Packaging Bonding is a complementary technology to silicon micromachining.  ...  As the herald of the bulk process, a low temperature direct bonding technology was developed and evaluated. These works are described in chapter 5.  ... 
doi:10.1002/9781118921616.ch5 fatcat:oczbl2hzfzg2jpdb4x3zn4fyxm

Microelectronic device data handbook

1969 Microelectronics and reliability  
type (low Q due to effective series resistance of the top contact) for bypass and voltage tuning.  ...  The die bonding is followed by bonding gold or aluminum wires between the bonding islands on the IC die and the inner portions of the package leads.  ...  The objective of the contract was to up-date and refine the Handbook in order to maximize its usefulness to those whose responsibility it is to select and utilize microelectronics in space hardware.  ... 
doi:10.1016/0026-2714(69)90058-4 fatcat:v4yxqzpnpfh6lpavqgzxveaz7q

Design automation methodology and rf/analog modeling for rf CMOS and SiGe BiCMOS technologies

D. L. Harame, K. M. Newton, R. Singh, S. L. Sweeney, S. E. Strang, J. B. Johnson, S. M. Parker, C. E. Dickey, M. Erturk, G. J. Schulberg, D. L. Jordan, D. C. Sheridan (+6 others)
2003 IBM Journal of Research and Development  
Finally, the unit and integration testing of all of these components is performed thoroughly. This paper describes each of these aspects and provides an overview of associated development work.  ...  The rapidly expanding telecommunications market has led to a need for advanced rf integrated circuits.  ...  We acknowledge the RFIC design centers in Encinitas, California, and Lowell, Massachusetts, for technology direction and early evaluation of the technology and design kits.  ... 
doi:10.1147/rd.472.0139 fatcat:pejbk72rafbfxkagylkctnet24

HaLoS – Integrated RF-Hardware Components for Ultra-Wideband Localization and Sensing [chapter]

Stefan Heinen, Ralf Wunderlich, Markus Robens, Jurgen Sachs, Martin Kmec, Robert Weigel, Thomas Umuller, Benjamin Sewiolo, Mohamed Hamouda, Rolf Kraemer, Johann-Christoph Scheytt, Yevgen Borokhovych
2013 Ultra-Wideband Radio Technologies for Communications, Localization and Sensor Applications  
Borkowski in the manufacture of the electronic and mechanical components.  ...  The authors greatly appreciate the discussions and valuable support in electronic design given by M. Grimm, R. Herrmann, P. Rauschenbach and K. Schilling, as well as the support given by K.  ...  Single chip transceiver head evaluation For the sensor head prototype evaluation, the transceiver chip has been measured on wafer as well as packaged with well-established chip-on-board technology using  ... 
doi:10.5772/54987 fatcat:htdlugglxzcxtjngilwtxlyjci

Chemical bionics - a novel design approach using Ion Sensitive Field Effect Transistors

Pantelis Georgiou, Chris Toumazou
2008 2008 IEEE Biomedical Circuits and Systems Conference  
interface, Q SS , as well as the depletion charge in silicon, Q B , and the Fermi potential of the semiconductor, φ f .  ...  Kostis Michaelakis, Dr Tim Constandinou, and Dr Leila Shepherd 1 VDS > 4Ut for Weak Inversion saturation Figure 4 . 4 14: ID-VGS sweeps of device for three separate packages on separate days.  ...  For the chemical bionic neuron introduced in Chapter 2, it would allow detection of chemical activity around the nerve bundle and a reconstruction the action potential in silicon.  ... 
doi:10.1109/biocas.2008.4696916 fatcat:gpp7jxugwjarnakqghdguz3xwm

An on sun parametric study of solar hydrogen production using WO3 photoanodes

Christopher K. Halford, Robert F. Boehm
2011 Experimental Thermal and Fluid Science  
Resistivity Control Loop Lines 533-564 define the logic used by the resistivity control loop.  ...  An additional parallel circuit is used for the resistivity control loop.  ...  as (this estimate is based upon the American National Standards Institue special limits of error for type T thermocouple and the estimated error of the reference junction provided by Campbell Scientific  ... 
doi:10.1016/j.expthermflusci.2010.08.019 fatcat:3gpxoyho5vhadd6vreewroersa

Towards CMOS Integrated Microfluidics Using Dielectrophoretic Immobilization

Matbaechi Ettehad, Yadav, Guha, Wenger
2019 Biosensors  
DEP can be performed using advanced planar technologies, such as complementary metal-oxide-semiconductor (CMOS) through interdigitated capacitive biosensors.  ...  A rigorous study of the DEP force actuation, the IDE's geometrical structure, and the fluid dynamics are crucial for enabling the complete platform for CMOS integrated microfluidics and detection of micron  ...  Acknowledgments: The authors would like to thank the technology department of IHP for the fabrication of the sensor chip. Conflicts of Interest: The authors declare no conflict of interest.  ... 
doi:10.3390/bios9020077 pmid:31195725 pmcid:PMC6628019 fatcat:eri7vpy5ffasticiop3mrgzv3u

Program Book

2021 2021 IEEE MTT-S International Microwave Symposium (IMS)  
circuits and systems are emerging, preparing the next computing revolution In this Workshop we will explore state of art status of Quantum computing applications and their associated technology and circuits  ...  Majorana fermions All of these Qubits require cryogenic temperatures (<4K) to operate efficiently, and need, and restitute Analog-RF signals for their manipulation, and results respectively Thus, there  ...  WEMA44 13:45 -14:00 Improved Strategies for Adaptive Frequency Sweeps Ralf Ihmels Mician, Inc.  ... 
doi:10.1109/ims19712.2021.9575039 fatcat:5ga53lbfuff77k7wodk45e7pyy


Vasyl Yatsuk, Tetiana Bubela, Mykola Mykyychuk, Yevhen Pokhodylo
2018 Measuring Equipment and Metrology  
, and semiconductors.  ...  Figures 8.01 and 8.02 show the frequency response of harmonic resonators with Q = 1 and 100,000. For Q = 100,000, the accelerometer is accurate within 10% to 1/3 of its resonant frequency.  ... 
doi:10.23939/istcmtm2018.03.071 fatcat:cflwt7xlcfdlppffcj4grxdedi

Copyright Page [chapter]

2018 The RF and Microwave Handbook - 3 Volume Set  
Reasonable efforts have been made to publish reliable data and information, but the author and the publisher cannot assume responsibility for the validity of all materials or for the consequences of their  ...  Reprinted material is quoted with permission, and sources are indicated. A wide variety of references are listed.  ...  This is easy to do with copious amounts of data gathered over the I/V -plane. • Part placement in the package and bond wire loop profile, manually executed by an operator, lead to bond wire length differences  ... 
doi:10.1201/9781315217703-18 fatcat:wmkr4uimdjexjg7wuanbgkolp4

UWB waveform generator for digital CMOS radar

Oystein Bjorndal, Svein-Erik Hamran, Tor Sverre Lande
2015 2015 IEEE International Symposium on Circuits and Systems (ISCAS)  
We here explore, and show the feasibility of, several single bit square wave radar architectures; that benefits from the continuous improvement in digital technologies for system-on-chip digital integration  ...  Small, low cost, radar systems have exciting applications in monitoring and imaging for the industrial, healthcare and Internet of Things (IoT) sectors.  ...  Acknowledgment The authors would like to thank Kristian Gjertsen Kjelgård for assistance with measurements and insightful discussions.  ... 
doi:10.1109/iscas.2015.7168932 dblp:conf/iscas/BjorndalHL15 fatcat:hsaophgfxbgfxevpohbmn5dde4

Chemical Vapor Deposition (CVD) [chapter]

Yoke Khin Yap, Dongyan Zhang
2016 Encyclopedia of Nanotechnology  
(>20-50 dB for frequencies beyond 10 GHz), very high linearity (>66 dBm third-order intercept point), and nearzero power consumption ($tens of nJ per  ...  Overview Capacitive and direct current (dc)-contact MEMS switches are among the most important micromachined devices for high-frequency applications due to their near-ideal RF performance.  ...  Carbon Nanotubes for Chip Interconnections, C The resistance of a CNT contacted at both ends is the sum of three resistances [5, 10] : R CNT ¼ R Q þ R L þ R CONTACT where R Q is the quantum resistance  ... 
doi:10.1007/978-94-017-9780-1_345 fatcat:hqqkocm2sne5jp32r7akdjceyi

Cell Micro-patterning [chapter]

2016 Encyclopedia of Nanotechnology  
(>20-50 dB for frequencies beyond 10 GHz), very high linearity (>66 dBm third-order intercept point), and nearzero power consumption ($tens of nJ per  ...  Overview Capacitive and direct current (dc)-contact MEMS switches are among the most important micromachined devices for high-frequency applications due to their near-ideal RF performance.  ...  Carbon Nanotubes for Chip Interconnections, C The resistance of a CNT contacted at both ends is the sum of three resistances [5, 10] : R CNT ¼ R Q þ R L þ R CONTACT where R Q is the quantum resistance  ... 
doi:10.1007/978-94-017-9780-1_100152 fatcat:msyahfwivvcxhol3nltwdi546e

Strategies for optical control and simultaneous electrical readout of extended cortical circuits

P. Ledochowitsch, A. Yazdan-Shahmorad, K.E. Bouchard, C. Diaz-Botia, T.L. Hanson, J.-W. He, B.A. Seybold, E. Olivero, E.A.K. Phillips, T.J. Blanche, C.E. Schreiner, A. Hasenstaub (+3 others)
2015 Journal of Neuroscience Methods  
Conclusions We demonstrate techniques for the large-scale simultaneous interrogation of cortical circuits in three commonly used mammalian species.  ...  Results We demonstrate that variations of this approach are broadly applicable across three commonly studied mammalian species-mouse, rat, and macaque monkey-and that the recorded ECoG signal shows complex  ...  Acknowledgements The authors thank the staff of the U.C. Berkeley Marvell Nanolab (  ... 
doi:10.1016/j.jneumeth.2015.07.028 pmid:26296286 fatcat:asnccljkczdq7hqxjcb4xxwbxe

An introduction to InP-based generic integration technology

Meint Smit, Xaveer Leijtens, Huub Ambrosius, Erwin Bente, Jos van der Tol, Barry Smalbrugge, Tjibbe de Vries, Erik-Jan Geluk, Jeroen Bolk, Rene van Veldhoven, Luc Augustin, Peter Thijs (+43 others)
2014 Semiconductor Science and Technology  
Photonic integrated circuits (PICs) are considered as the way to make photonic systems or subsystems cheap and ubiquitous.  ...  PICs still are several orders of magnitude more expensive than their microelectronic counterparts, which has restricted their application to a few niche markets.  ...  Many others have contributed and the authors would like to thank other PARADIGM and EuroPIC partners for their help in discussions, particularly Michael Robertson (CIP).  ... 
doi:10.1088/0268-1242/29/8/083001 fatcat:qluag4mh5jesleer7jitovsud4
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