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E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System [article]

Bei Yu and Kun Yuan and Jhih-Rong Gao and David Z. Pan
2014 arXiv   pre-print
In this paper, we present E-BLOW, a tool to solve the overlapping aware stencil planning (OSP) problems in MCC system.  ...  Experimental results show that, compared with previous works, E-BLOW demonstrates better performance for both conventional EBL system and MCC system.  ...  Overlapping aware Stencil Planning (OSP) for MCC system: Given a set of character candidate C C , select a subset C CP out of C C as characters, and place them on the stencil.  ... 
arXiv:1402.2435v1 fatcat:kec4fm5gu5gljh5tji3ogfbn4e

E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System [article]

Bei Yu and Kun Yuan and Jhih-Rong Gao and David Z. Pan
2015 arXiv   pre-print
In this paper, we prove that the overlapping aware stencil planning (OSP) problem is NP-hard.  ...  Because of the area constraint of stencil, MCC system needs to be packed/planned carefully to take advantage of the characters.  ...  Shiyan Hu at Michigan Technological University and Zhao Song at University of Texas for helpful comments.  ... 
arXiv:1502.00621v1 fatcat:bfzoeqhvkze55pqlevunmma7ru

Design for Manufacturing With Emerging Nanolithography

David Z. Pan, Bei Yu, Jhih-Rong Gao
2013 IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems  
Index Terms-Design for manufacturing, double patterning, e-beam lithography (EBL), EUV lithography (EUVL), multiple patterning, nanolithography, physical design.  ...  In this paper, we survey key design for manufacturing issues for extreme scaling with emerging nanolithography technologies, including double/multiple patterning lithography, extreme ultraviolet lithography  ...  Puri, IBM, for their helpful discussions.  ... 
doi:10.1109/tcad.2013.2276751 fatcat:amxc565rjfg6bkliymbbbjczde