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E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System
[article]
2014
arXiv
pre-print
Preserved Fulltext
In this paper, we present E-BLOW, a tool to solve the overlapping aware stencil planning (OSP) problems in MCC system. ...
Experimental results show that, compared with previous works, E-BLOW demonstrates better performance for both conventional EBL system and MCC system. ...
Overlapping aware Stencil Planning (OSP) for MCC system: Given a set of character candidate C C , select a subset C CP out of C C as characters, and place them on the stencil. ...
arXiv:1402.2435v1
fatcat:kec4fm5gu5gljh5tji3ogfbn4e
E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System
[article]
2015
arXiv
pre-print
Preserved Fulltext
A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2020; you can also visit the original URL.
The file type is application/pdf.
In this paper, we prove that the overlapping aware stencil planning (OSP) problem is NP-hard. ...
Because of the area constraint of stencil, MCC system needs to be packed/planned carefully to take advantage of the characters. ...
Shiyan Hu at Michigan Technological University and Zhao Song at University of Texas for helpful comments. ...
arXiv:1502.00621v1
fatcat:bfzoeqhvkze55pqlevunmma7ru
Design for Manufacturing With Emerging Nanolithography
2013
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Preserved Fulltext
A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2015; you can also visit the original URL.
The file type is application/pdf.
Index Terms-Design for manufacturing, double patterning, e-beam lithography (EBL), EUV lithography (EUVL), multiple patterning, nanolithography, physical design. ...
In this paper, we survey key design for manufacturing issues for extreme scaling with emerging nanolithography technologies, including double/multiple patterning lithography, extreme ultraviolet lithography ...
Puri, IBM, for their helpful discussions. ...
doi:10.1109/tcad.2013.2276751
fatcat:amxc565rjfg6bkliymbbbjczde