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In this paper, we present E-BLOW, a tool to solve the overlapping aware stencil planning (OSP) problems in MCC system. ... Experimental results show that, compared with previous works, E-BLOW demonstrates better performance for both conventional EBL system and MCC system. ... Overlapping aware Stencil Planning (OSP) for MCC system: Given a set of character candidate C C , select a subset C CP out of C C as characters, and place them on the stencil. ...arXiv:1402.2435v1 fatcat:kec4fm5gu5gljh5tji3ogfbn4e
In this paper, we prove that the overlapping aware stencil planning (OSP) problem is NP-hard. ... Because of the area constraint of stencil, MCC system needs to be packed/planned carefully to take advantage of the characters. ... Shiyan Hu at Michigan Technological University and Zhao Song at University of Texas for helpful comments. ...arXiv:1502.00621v1 fatcat:bfzoeqhvkze55pqlevunmma7ru
Index Terms-Design for manufacturing, double patterning, e-beam lithography (EBL), EUV lithography (EUVL), multiple patterning, nanolithography, physical design. ... In this paper, we survey key design for manufacturing issues for extreme scaling with emerging nanolithography technologies, including double/multiple patterning lithography, extreme ultraviolet lithography ... Puri, IBM, for their helpful discussions. ...doi:10.1109/tcad.2013.2276751 fatcat:amxc565rjfg6bkliymbbbjczde