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Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response

Nuno Brito, Carlos Ferreira, Filipe Alves, Jorge Cabral, João Gaspar, João Monteiro, Luís Rocha
2016 Sensors  
A complete digital solution for fast testing and characterization of inertial sensors with built-in actuation mechanisms is presented in this paper, with a fast, full-wafer test as a leading ambition.  ...  The full electrical approach and flexibility of modern hardware design technologies allow a fast adaptation for other physical domains with minimum effort.  ...  The digital platform developed was used to perform tests at the wafer-level.  ... 
doi:10.3390/s16091553 pmid:27657087 pmcid:PMC5038823 fatcat:fyddmtsxjfecdf444jhel4cxoy

Towards a Scalable Sun Position Sensor with Monolithic Integration of the 3d Optics for Miniaturized Satellite Attitude Control

Joost Romijn, Sten Vollebregt, Henk W. van Zeijl, Guoqi Zhang, Johan Leijtens, Pasqualina M. Sarro
2021 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)  
This mitigates the need for cumbersome alignment of the apertures at die or package level and facilitates further miniaturization, accuracy and sensor cost.  ...  In this paper we present a sun position sensor platform with a scalable approach for the 3D integration of the sensor optics.  ...  This project was funded by the Netherlands Organization for Scientific Research (NWO), project number 16247.  ... 
doi:10.1109/mems51782.2021.9375434 fatcat:5uvfkixi5neenesxsjw6wx2ypm

Analysis and wafer-level design of a high-order silicon vibration isolator for resonating MEMS devices

Sang Won Yoon, Sangwoo Lee, Noel C Perkins, Khalil Najafi
2010 Journal of Micromechanics and Microengineering  
This isolation platform, made from a thick silicon wafer substrate for an environment-resistant MEMS package, incorporates the functionalities of a previous design including vacuum packaging and thermal  ...  This paper presents the analysis and preliminary design, fabrication, and measurement for mechanical vibration-isolation platforms especially designed for resonating MEMS devices including gyroscopes.  ...  The authors especially thank Professor K Grosh and Dr R Littrell (Mechanical Engineering, University of Michigan) for their help in conducting the laser vibrometer measurements.  ... 
doi:10.1088/0960-1317/21/1/015017 fatcat:p7kxucc2mrbwvexv5u5erydtdy

Miniature origami-like folded MEMS TIMU

A. Efimovskaya, D. Senkal, A.M. Shkel
2015 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)  
Initial characterization confirmed the potential of folded MEMS approach for implementation of low-noise inertial sensors, demonstrating VRW of 0.078 m/s/ √ h and bias instability of <0.2 mg for accelerometers  ...  In this paper, we report implementation of a folded MEMS concept, demonstrating a prototype of Timing and Inertial Measurement Unit (TIMU) in < 50 mm 3 volume.  ...  Devices were designed, developed, and tested at Mi-croSystems Laboratory, UC Irvine. Authors would like to acknowledge Sina Askari for his help in PCB design and fabrication.  ... 
doi:10.1109/transducers.2015.7180991 fatcat:jtbphsozunbhdpnr6gotbbpfmy

A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging

Pengfei Xu, Chaowei Si, Yurong He, Zhenyu Wei, Lu Jia, Guowei Han, Jin Ning, Fuhua Yang
2021 Sensors  
A self-developed control circuit is adopted to realize loop control and characterize gyroscope performances.  ...  Moreover, a novel 3D packaging technique is used to realize high Q-factors.  ...  In this work, a novel high-Q dual-mass MEMS TFG with 3D wafer-level packaging is reported.  ... 
doi:10.3390/s21196428 pmid:34640747 fatcat:j7ujtzcopjbwxpnc2y2rnrheqa

Chip-scale IMU using folded-mems approach

Sergei A Zotov, Montgomery C Rivers, Alexander A Trusov, Andrei M Shkel
2010 2010 IEEE Sensors  
Assembly is done on the wafer level forming a compact rigid 6-axis system of sensors.  ...  The results confirm feasibility of the proposed folded MEMS IMU approach, and may enable new integrated architectures for other multi-axis dynamic sensors, such as 3-D microphones, hydrophones, and ultrasonic  ...  for providing the microscopes necessary for SEM imaging, Roger Young at FAST Semiconductor for assistance in packaging, and Igor Prikhodko for discussions on testing.  ... 
doi:10.1109/icsens.2010.5690800 fatcat:cxk7ai6aevhsxgvv3vzuzthhd4

Folded MEMS Pyramid Inertial Measurement Unit

Sergei A. Zotov, Montgomery C. Rivers, Alexander A. Trusov, Andrei M. Shkel
2011 IEEE Sensors Journal  
This paper reports a new approach for design and fabrication of chip-level inertial measurement units (IMUs).  ...  Structural rigidity and sensor axis alignment stability of the folded IMUs have been characterized under various environmental conditions, including vibration, thermal loading, thermal shock, and constant  ...  Senkal for aid in finite-element modeling, and I. Prikhodko for discussions and helping with sensor characterization.  ... 
doi:10.1109/jsen.2011.2160719 fatcat:635nrv75krezfm4ztcl5hklh2m

Realization of nanoscale resolution with a micromachined thermally actuated testing stage

Shaoning Lu, Dmitriy A. Dikin, Sulin Zhang, Frank T. Fisher, Junghoon Lee, Rodney S. Ruoff
2004 Review of Scientific Instruments  
The design, fabrication, and characterization of a microelectromechanical systems ͑MEMS͒ stressstrain device for testing the mechanical properties of nanomaterials is presented.  ...  The operating characteristics obtained for this initial design suggest that this methodology will be useful in producing a variety of MEMS stress-strain stages custom designed to yield the force and displacement  ...  Scanning electron microscopy testing was done at the Electron Probe Instrumentation Center at Northwestern University.  ... 
doi:10.1063/1.1710703 fatcat:6kxquvfra5ejxgha27aiy2qd3e

MEMS-enabled Silicon Photonic Integrated Devices and Circuits

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Yu Zhang, Peter Verheyen, Wim Bogaerts, Pierre Edinger, Carlos Errando-Herranz, Kristinn B. Gylfason
2019 IEEE Journal of Quantum Electronics  
We here demonstrate integration of MEMS-enabled components in a simplified silicon photonics process based on IMEC's Standard iSiPP50G Silicon Photonics Platform and a custom release process.  ...  This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology platforms.  ...  Although process development and MEMS release were performed on coupon-and chip-level, all process steps are wafer-level compatible, allowing direct transfer to a foundry and also to include wafer level  ... 
doi:10.1109/jqe.2019.2946841 fatcat:syxbmf365feqto4kjcvy7s3muu

Silicon photonic MEMS phase shifters for scalable programmable photonic circuits

Pierre Edinger, Alain Takabayashi, Carlos Errando-Herranz, Umar Khan, Hamed Sattari, Peter Verheyen, Wim Bogaerts, Niels Quack, Kristinn Gylfason
2021 Optics Letters  
Programmable photonic integrated circuits are emerging as an attractive platform for applications such as quantum information processing and artificial neural networks.  ...  Here, we demonstrate a compact phase shifter with low-power photonic microelectromechanical system (MEMS) actuation on a silicon photonics foundry platform (IMEC's iSiPP50G).  ...  Max Yan for access to measurement equipment and Mikael Bergqvist for assistance with setups.  ... 
doi:10.1364/ol.436288 pmid:34780433 fatcat:nl4nkhkktfgl5g7fv5jdihiadq

Instrument for Lunar Seismic Activity Studies on Chandrayaan-2 Lander

J. John, V. Thamarai, M. M. Mehra, Teena Choudhary, M. S. Giridhar, Ashwini Jambhalikar, Gogulapati Supriya, Gaurav Saxena, K. V. Shila, B. Ramesh, T. K. Pratheek, Deepak Kumar Sharma (+6 others)
2020 Current Science  
This paper presents the basic concepts in the design, realization, characterization and the performance test results of the space qualified strong motion seismic sensors.  ...  Instrument for Lunar Seismic Activity Studies (ILSA) is a science payload with the objective of studying seismic activities at the landing site of Vikram, the Lander of Chandrayaan-2.  ...  The generation of clock signals for excitation of MEMS sensor, SDA and SCLK for I2C interface, analog to digital conversion of signal from fine range sensor, formatting of data to communicate to command  ... 
doi:10.18520/cs/v118/i3/376-382 fatcat:atj4pmlxrfabdmv6zthzegitau

Parallel-kinematics XYZ MEMS part 2: Fabrication and experimental characterization

Bonjin Koo, Jorge E. Correa, Placid M. Ferreira
2016 Precision engineering  
This paper, the second of a set of two papers addressing parallel-kinematics MEMS stages for spatial translation, deals with fabrication, characterization and control of such devices.  ...  Further, it characterizes the performance of the individual actuating and sensing elements, configures feedback controllers for each actuated joint, and assesses and verifies the stage's designed performance  ...  The authors acknowledge the use of the Micro-Nano Mechanical Systems Laboratory and the Micro-Nano Technology Laboratory for the fabrication and characterization of the devices reported in this paper.  ... 
doi:10.1016/j.precisioneng.2016.04.008 fatcat:vbyfqiulffhdnjpprgzprpimqq

A review of microelectromechanical systems for nanoscale mechanical characterization

Yong Zhu, Tzu-Hsuan Chang
2015 Journal of Micromechanics and Microengineering  
Focusing on key design considerations, this article aims to provide useful guidelines for developing MEMS platforms.  ...  A large number of MEMS platforms and related nanomechanics studies are presented to demonstrate the unprecedented capabilities of MEMS for nanoscale mechanical characterization.  ...  CMMI-1301193 and DMR-1410475 is gratefully acknowledged.  ... 
doi:10.1088/0960-1317/25/9/093001 fatcat:orjxb6vtv5eajf2mhdrjfrhrum

A 3mm endoscopic probe with integrated MEMS micromirror for optical coherence tomography bioimaging

X.J. Mu, G.Y. Zhou, H.H. Feng, Y.S. Xu, A.B. Yu, C.W. Tan, K.W.S. Chen, J. Xie, F.S. Chau
2010 Procedia Engineering  
By integrating the MEMS micromirror with a commercial Optical Coherence Tomography system and miniaturized probe, high resolution 2-D/3-D in vivo and in situ images and excellent optical sectioning for  ...  The optical probe is enclosed within a biocompatible, transparent and waterproof polycarbonate tube for in vivo diagnostic applications.  ...  A photograph of the probe holder and multi-axis sample platform for testing is shown in Fig. 7(b) .  ... 
doi:10.1016/j.proeng.2010.09.201 fatcat:hh6urawwdbhwbi7m424454uaqm

A Resonant Pressure Sensor Based upon Electrostatically Comb Driven and Piezoresistively Sensed Lateral Resonators

Xiaoqing Shi, Sen Zhang, Deyong Chen, Junbo Wang, Jian Chen, Bo Xie, Yulan Lu, Yadong Li
2019 Micromachines  
were used for electrostatic excitation and piezoresistive detection, respectively.  ...  The developed resonant pressure sensors were fabricated based on MEMS with open-loop and closed-loop characterizations conducted.  ...  The proposed pressure sensor was fabricated by SOI-MEMS process. The performances of sensors were characterized by open-loop and closed-loop platforms.  ... 
doi:10.3390/mi10070460 pmid:31288381 pmcid:PMC6680778 fatcat:kzgo2hj5nfd67dmlyrug7qiof4
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