Filters








16,060 Hits in 5.5 sec

A low-power and high-performance CMOS fingerprint sensing and encoding architecture

S. Jung, R. Thewes, T. Scheiter, K.F. Goser, W. Weber
1999 IEEE Journal of Solid-State Circuits  
Index Terms-Cellular automaton, fingerprint encoding, fingerprint sensor, image processing, low-power design, neuron MOS, pixel-parallel circuits.  ...  Image processing is achieved by application of hexagonal local operators implemented in pixel-parallel mixed neuron-MOS/CMOS logic circuits.  ...  Jacobs for support in simulation techniques, H. Mulatz for packaging of the demonstrator chip, and C. Pacha for early conceptual discussions.  ... 
doi:10.1109/4.772413 fatcat:ydshea7ytrbvflg6p7n23u2q4q

3D design activities at Fermilab—Opportunities for physics

Raymond Yarema, Grezgorz Deptuch, Jim Hoff, Alpana Shenai, Marcel Trimpl, Tom Zimmerman, Marcel Demarteau, Ron Lipton, Dave Christian
2010 Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment  
Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006.  ...  These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds.  ...  Acknowledgements The author wishes to thank the dedicated members of the ASIC group (G. Deptuch, J. Hoff, A. Shenai, M. Trimpl, and T. Zimmerman) who designed the circuits described in this paper.  ... 
doi:10.1016/j.nima.2009.09.045 fatcat:e6ddsyixh5b4dc5kdrscxscmsu

Amorphous IGZO Thin-Film Transistor Gate Driver in Array for Ultra-Narrow Border Displays

Liufei Zhou, Xiaojun Guo, Bang Ouyang, Li'Ang Deng, Mingxin Wang, Qungang Ma, Baoping Wang
2022 IEEE Journal of the Electron Devices Society  
A gate driver in array (GIA) design based on the amorphous indium gallium zinc oxide (a-IGZO) thin-film transistor (TFT) is developed for narrow border displays.  ...  Therefore, the pixel aperture ratio loss is minimized, and uniform placement of the gate driver circuits over the pixel array area is able to be achieved.  ...  (a) Schematic of the gate driver circuit design being integrated within the pixel array area. (b) Timing diagram of the control signals.  ... 
doi:10.1109/jeds.2022.3164887 fatcat:i6wmsza7hnak5gzplg5mtkkuae

Image Processor and RISC MCU Embedded Single Chip Fingerprint Sensor

Seungmin Jung
2020 Journal of Sensor and Actuator Networks  
The algorithm processor is a logic circuit that implements the GABOR filter and the THINNING step, which occupies 80% of the fingerprint image processing time.  ...  The layout is done by automatic P&R for the full chip in a 96 × 96 pixel array. The chip area is 5010 μm × 5710 μm (28.61 mm2) and the gate count is 2,866,700.  ...  Conflicts of Interest: The authors declare no conflict of interest.  ... 
doi:10.3390/jsan9040051 fatcat:u3iwacrpxzadllqt5xaqufqt6q

Design of Thin-Film-Transistor (TFT) arrays using current mirror circuits for Flat Panel Detectors (FPDs) [article]

Nur Sultan Salahuddin , Michel Parmentier Gunadarma University,
2011 arXiv   pre-print
The TFTs arrays 4x4 matrix using current mirror circuits have been fabricated and tested with success. The TFTs array directly can process signals coming from 16 pixels in the same node.  ...  This enables us to make the summation of the light intensities of close pixels during a reading.  ...  The heart of the flat panel digital detector consists of a two-dimensional array of amorphous silicon photodiodes and thin-film transistors (TFTs) [1] , all deposited on a single substrate.  ... 
arXiv:1105.1407v1 fatcat:2qtsygguuvd2bj6scpcwo5d43e

CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration

Fredrik Forsberg, Adriana Lapadatu, Gjermund Kittilsland, Stian Martinsen, Niclas Roxhed, Andreas C. Fischer, Goran Stemme, Bjorn Samel, Per Ericsson, Nils Hoivik, Thor Bakke, Martin Bring (+3 others)
2015 IEEE Journal of Selected Topics in Quantum Electronics  
The microbolometers are designed to detect light in the long wavelength infrared (LWIR) range from 8 to 14 μm and are arranged in focal plane arrays consisting of 384 × 288 microbolometer pixels with a  ...  pixel pitch of 25 μm × 25 μm.  ...  The focal plane array circuit contains an area for an array of 384 × 288 microbolometer pixels with a pixel pitch of 25 μm × 25 μm along with on-chip analog to digital conversion, compensation and communication  ... 
doi:10.1109/jstqe.2014.2358198 fatcat:acakogvmubhqpncbcyxbjid2qm

The heterogeneous integration of optical interconnections into integrated microsystems

N.M. Jokerst, M.A. Brooke, Sang-Yeon Cho, S. Wilkinson, M. Vrazel, S. Fike, J. Tabler, Yoong Joon Joo, Sang-Woo Seo, D.S. Wills, A. Brown
2003 IEEE Journal of Selected Topics in Quantum Electronics  
onto a foundry Si CMOS microprocessor to demonstrate a single chip optically interconnected microprocessor, smart pixel emitter and detector arrays using resonant cavity enhanced P-i-N photodetectors  ...  Demonstrations of interconnections using thin film heterogeneous integration technology include an integrated InGaAs/Si CMOS receiver circuit operating at 1 Gbps, an InGaAs thin film photodetector bonded  ...  ACKNOWLEDGMENT The authors wish to thank the Microelectronics Research Center staff of the Georgia Institute of Technology, Atlanta, for their assistance with microfabrication, and DuPont for the donation  ... 
doi:10.1109/jstqe.2003.813307 fatcat:cklygy4rojbvvgfo5vbcerytza

A single-chip fingerprint sensor and identifier

S. Shigematsu, H. Morimura, Y. Tanabe, T. Adachi, K. Machida
1999 IEEE Journal of Solid-State Circuits  
The fingerprint identifier is formed by an array of pixels, and each pixel contains a sensing element and a processing element.  ...  The sensing element senses capacitances formed by a finger surface to capture a fingerprint image. An identification is performed by the pixel-parallel processing of the pixels.  ...  Wakimoto for their support and comments.  ... 
doi:10.1109/4.808910 fatcat:etazqkmtgreejcspahahtzzjem

Ultra-Thin Chips with ISFET Array for Continuous Monitoring of Body Fluids pH

Mahdieh Shojaei Baghini, Anastasios Vilouras, Ravinder Dahiya
2022 IEEE Transactions on Biomedical Circuits and Systems  
The SoUTC with the proposed current-mode active-pixel ISFET circuit array is desined to operate at 2V and consumes 6.28 W per-pixel.  ...  This paper presents ISFET array based pH-sensing system-on-ultra-thin-chip (SoUTC) designed and fabricated in 350 nm CMOS technology.  ...  Each IC of area 16 mm 2 consists of 512 ISFET pixel circuits distributed over the chip in a split-array format with a pitch of 40 µm between two adjacent individual pixel circuits of each array.  ... 
doi:10.1109/tbcas.2022.3141553 pmid:35007198 fatcat:nber5vn3obeo5ks3ru75al4t3y

Novel Method For The Analysis Of Printed Circuit Images

Jon R. Mandeville, Andrew G. Tescher
1984 Applications of Digital Image Processing VII  
These operations can be realized using simple processing elements which are well suited for implementation in hardware. * This is based on using a Vicom Model VDC 1600 with an array processor that can  ...  A region is a set of nonzero pixels each of which is connected to all other pixels in the set.  ...  Each algorithm uses a different thinning process designed so that a particular defect class induces a known corresponding class of skeletal features that can be easily and reliably detected.  ... 
doi:10.1117/12.944849 fatcat:joz46rwybjhbtai5i6up6pm3um

Trigger-wave collision detecting asynchronous cellular logic array for fast image skeletonization

Przemyslaw Mroszczyk, Piotr Dudek
2012 2012 IEEE International Symposium on Circuits and Systems  
This paper presents the design of an asynchronous cellular logic array for binary image processing algorithms based on wave propagation/collision in an excitable medium.  ...  The proposed array could be used as a coprocessor in pixel-parallel SIMD architectures aiding the fast execution of medium-level image processing algorithms.  ...  The proposed circuit will be of use in the design of pixel-parallel cellular processor array devices. Figure 1 . 1 Figure 1.  ... 
doi:10.1109/iscas.2012.6271852 dblp:conf/iscas/MroszczykD12 fatcat:zuyfj2wu2bdpjct7hx7xe7klzu

Novel method for analysis of printed circuit images

Jon R. Mandeville
1985 IBM Journal of Research and Development  
These operations can be realized using simple processing elements which are well suited for implementation in hardware. * This is based on using a Vicom Model VDC 1600 with an array processor that can  ...  A region is a set of nonzero pixels each of which is connected to all other pixels in the set.  ...  Each algorithm uses a different thinning process designed so that a particular defect class induces a known corresponding class of skeletal features that can be easily and reliably detected.  ... 
doi:10.1147/rd.291.0073 fatcat:hxehdmbe2fecbdc42wbruaho7m

CMOS Active Pixel Sensor (APS) Imager for Scientific Applications

Suat U. Ay, Michael P. Lesser, Eric R. Fossum, J. Anthony Tyson, Sidney Wolff
2002 Survey and Other Telescope Technologies and Discoveries  
This device is going to be used as a test vehicle to develop backside-thinning process.  ...  A 512x512 CMOS Active Pixel Sensor (APS) imager has been designed, fabricate, and tested for frontside illumination suitable for use in astronomy specifically in telescope guider systems as a replacement  ...  Work at the University of Arizona is supported by National Science Foundation Grant AST-9876630.  ... 
doi:10.1117/12.461429 fatcat:v37c2pmlonatdjtk4z3mcsb4uu

TMP5X5T1M: A Configurable Binary Morphological and Template Matching Processor

Yudi Yanuhardi, Trio Adiono, Tati Rajab Mengko
1996 IAPR International Workshop on Machine Vision Applications  
Ganesha 10 Bandung 40132 -I n d o n e s i a Phone.  ...  The processor was fabricated in 0.8 pm CMOS Gate Array technology and has capability to process maximum 1024x 1024 pixels binary image with 5x5 template size in a speed of 200 ns per pixel at 10 MHz clock  ...  Output mode consists of seven modes for single processing operations, nine modes for parallel processing operations, and one mode for parallel thinning operation.  ... 
dblp:conf/mva/YanuhardiAM96 fatcat:fw3qcrcfujha3kqrrf4nvwunuy

Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits

C.L. Chen, D-R. Yost, J.M. Knecht, D.C. Chapman, D.C. Oakley, L.J. Mahoney, J.P. Donnelly, A.M. Soares, V. Suntharalingam, R. Berger, V. Bolkhovsky, W. Hu (+3 others)
2009 2009 IEEE International Conference on 3D System Integration  
A 1024 x 1024 diode array with 8-μm pixel size is demonstrated. This work shows the wafer-scale 3D integration of a compound semiconductor with Si.  ...  In this work, we modified our wafer-scale 3D integration technique, originally developed for Si, to hybridize InP-based image sensor arrays with Si readout circuits.  ...  (a) Photo shows 3D vias in the array with Si readout circuit for each pixel. (b) Close up of the 3D via landing on PIN metal contact.  ... 
doi:10.1109/3dic.2009.5306556 dblp:conf/3dic/ChenYKCOMDSSBBHWKS09 fatcat:pydor6z6cja2bo6k26qlp66j5q
« Previous Showing results 1 — 15 out of 16,060 results