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Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading on Electronics Packaging

Juan Gomez, Minghui Lin, Cemal Basaran
2006 Multidiscipline Modeling in Materials and Structures  
Damage mechanics constitutive model for eutectic Pb/Sn solder alloys is used to simulate the damage effects of concurrent cyclic thermal loads and vibrations on Ball Grid Array (BGA) packages.  ...  The problem of concurrent thermal and vibration loading has not been thoroughly studied even though it is common in electronic packaging applications.  ...  ACKNOWLEDGMENTS This research project is supported by the United States Navy Office of Naval Research Advanced Electrical Power Systems Program, under the direction of director Terry Ericsen.  ... 
doi:10.1163/157361106777641387 fatcat:vixd2gezmjabhfczbg2b72qvlu

Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging

Cemal Basaran, Rumpa Chandaroy
2000 Computers & structures  
It is also shown that a simultaneous application of thermal and dynamic loads signi®cantly shortens the fatigue life of the solder joint.  ...  It is well established that heat generated by the circuits when the device is on leads to a thermal loading which is cycling in nature.  ...  N00014-97-1-0685 from the Department of Defense Oce of Naval Research Young Investigator Award Program. The Program Director for the project is Dr Roshdy Barsoum of ONR.  ... 
doi:10.1016/s0045-7949(99)00028-0 fatcat:wcbw44j35nfw5nghkjfe47zxju

Thermomechanical behavior of micron scale solder joints under dynamic loads

Y Zhao, C Basaran, A Cartwright, T Dishongh
2000 Mechanics of materials (Print)  
A concurrent loading unit is used which consists of a thermal environmental chamber and an electrodynamic shaker.  ...  Recent trends in reliability and fatigue life analysis of electronic devices have involved developing structural integrity models for predicting the operating lifetime under vibratory and thermal environmental  ...  Roshdy Barsoum, Director of Solid Mechanics Program at ONR are gratefully acknowledged.  ... 
doi:10.1016/s0167-6636(99)00053-8 fatcat:ncsq76pvwna3rax2t7x7rtheby

Nonlinear Dynamic Analysis [chapter]

2014 Theory of Nonlinear Structural Analysis  
The study of fatigue under concurrent loading will be the subject of another paper. 12  ...  The latter decision was a result of observations reported in Steinberg (1988) , that having in-phase or out-of-phase thermal loading in conjunction with vibrations makes a significant difference in the  ...  Roshdy Barsoum, Director of Solid Mechanics program at ONR for his constructive criticism.  ... 
doi:10.1002/9781118718070.ch3 fatcat:adyxk3fadbed3ezai3vrc3lw5a

Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations

Cemal Basaran, Rumpa Chandaroy
1998 Applied Mathematical Modelling  
The purpose of this study is to understand the mechanics of the vibration induced damage in solder interconnects.  ...  A material nonlinear time domain dynamic analysis of a solder joint was performed using a damage mechanics based constitutive model.  ...  Roshdy Barsoum, Director of Solid Mechanics program at ONR for his constructive criticism.  ... 
doi:10.1016/s0307-904x(98)10059-8 fatcat:reducrtydzc2plg55veh75izwm

Materials integrity in microsystems: a framework for a petascale predictive-science-based multiscale modeling and simulation system

Albert C. To, Wing Kam Liu, Gregory B. Olson, Ted Belytschko, Wei Chen, Mark S. Shephard, Yip-Wah Chung, Roger Ghanem, Peter W. Voorhees, David N. Seidman, Chris Wolverton, J. S. Chen (+6 others)
2008 Computational Mechanics  
An UQ methodology that determines the quality of predictive information available from experimental measurements and packages the information in a form suitable for UQ at various scales needs to be developed  ...  The development of a petascale predictive-science-based multiscale modeling and simulation system will advance the field of predictive multiscale science so that it can be used to reliably analyze problems  ...  Grain Boundary Diffusivity • Grain Boundary Evolution • Delamination And Damage Under Thermal Cycling And Shock Loading • Radiation Damage Au (350 nm) Si (Cap) Si (Substrate) Disc Damage  ... 
doi:10.1007/s00466-008-0267-1 fatcat:nt2nfepitfawthevze5pufoaeq

Lead-free Solder [chapter]

T.R. Bieler, Tae-kyu Lee
2010 Encyclopedia of Materials: Science and Technology  
See also: Electrical and Electronic Connectors: Materials and Technology; Electronic Packages: Quality and Reliability; Electronic Packaging Materials: Properties and Selection; Electronic Packaging: Thermal  ...  One of the driving forces is the thermal expansion difference between the package and the PCB.  ... 
doi:10.1016/b978-008043152-9.02239-9 fatcat:iio4apd77ndtjkdjao766eyita

Acceptance tests of the INTEGRAL Optical Monitoring Camera subsystems

Emmanuel Mazy, J.-Y. Plesseria, Etienne Renotte, Pierre P. Rochus, William Roybal
1999 Advanced Telescope Design, Fabrication, and Control  
Specific environmental tests, such as vibration and thermal tests are performed to verify the correct functioning of the mechanism in extreme conditions.  ...  The optical performances are verified (spectral range, PSF, MTF) and compared to predictions. The mechanical and thermal behaviours in space environment are then tested in CSL premises.  ...  Vibration tests results From a mechanical point of view, the first vibration test was successful, no visible damage was observed.  ... 
doi:10.1117/12.367608 fatcat:263z2nzyencr5dpborzum76ney

Low-Cycle-Fatigue Failures of Solder Material in Electronics Packaging: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review

Suhir E
2018 Journal of Aerospace Engineering and Mechanics  
The emphasis is on the design for reliability and, first of all, on the prediction of the thermal stresses and strains in solder joint interconnections in electronic products.  ...  This review paper is based mostly on the author's recent publications and addresses the application of analytical ("mathematical") predictive modeling to understand the physics and mechanics of the behavior  ...  One board was subjected, concurrently with random vibrations, to the low temperature of -20 °C = 253 °K and another one -to -100 °C = 173 °K.  ... 
doi:10.36959/422/433 fatcat:l7k3uzrhobaxbksebcwvtvn4ly

Power Electronics Reliability: State of the Art and Outlook

Huai Wang, Frede Blaabjerg
2020 IEEE Journal of Emerging and Selected Topics in Power Electronics  
It introduces the latest advances in the understanding of failure mechanisms, testing methods, accumulated damage modeling, and mission-profile-based reliability prediction.  ...  This paper aims to provide an update of the reliability aspects of research on power electronic components and hardware systems.  ...  Mission-profile-based reliability prediction and its challenges in thermal model simplification, and accumulated damage modeling are also presented.  ... 
doi:10.1109/jestpe.2020.3037161 fatcat:pmve7upm5za4njpdbyfjkizk54

Recent advancements in the electromechanical (E/M) impedance method for structural health monitoring and NDE

Victor Giurgiutiu, Craig A. Rogers, Mark E. Regelbrugge
1998 Smart Structures and Materials 1998: Smart Structures and Integrated Systems  
These recent developments accentuate the importance and benefits of using the electro-mechanical impedance method for online health monitoring and damage detection in a variety of applications.  ...  Attention is then focused on several recent advancements that have extended the electro-mechanical impedance method into new areas of applications and/or have developed its underlying principles.  ...  By focusing the attention on the its basic functions, miniaturization and electronic packaging principles can be applied, and transponder size dimensions can be achieved.  ... 
doi:10.1117/12.316923 fatcat:hzc37tmhmzdq5pjt26v7cfgn4u

Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring

Vinamra Bhushan Sharma, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma, Jae Pil Jung
2021 Metals  
With smart electronics and packaging technology, large amounts of complex monitoring data are generated, requiring sophisticated artificial intelligence (AI) techniques for their processing.  ...  Moreover, the Internet of Things (IoT) and smart city concepts are explained to elaborate on the contributions of intelligent SHM systems.  ...  [29] review thermal load and its distribution in bridges with emphasis on numerical analysis and field estimations.  ... 
doi:10.3390/met11101537 fatcat:wayx7vsxxrekrgpjrzrmxpqswm

Environmentally Friendly and Controllable Pyrolysis Method to Synthesize Ni-Modified Graphene Nanosheets as Reinforcement of Lead-Free Solder

Huigai Wang, Keke Zhang, Chenxiang Yin, Meng Zhang
2019 Metals  
The adsorption mechanism of a single Ni atom on the surface of perfect graphene and defective graphene was studied based on density functional theory.  ...  The morphology, microstructure, phase transition, and adsorption strength of nanoparticles on the surface of GNSs with various theoretical Ni loadings are characterized.  ...  Conflicts of Interest: The authors declare no conflict of interest.  ... 
doi:10.3390/met9101123 fatcat:omtyfuumurehxhqdjusvbuelhe

The 12K×8K CCD mosaic camera for the Palomar Transient Factory

Gustavo Rahmer, Roger Smith, Viswa Velur, David Hale, Nicholas Law, Khanh Bui, Hal Petrie, Richard Dekany, Ian S. McLean, Mark M. Casali
2008 Ground-based and Airborne Instrumentation for Astronomy II  
A much more compact filter mechanism was required and the electronics boxes had to be moved to the telescope exterior.  ...  One of the main objectives of the mechanical redesign effort was to keep the overall footprint of the camera to a minimum.  ... 
doi:10.1117/12.788086 fatcat:66m6w4mhinb6lcctrjfuezpmb4

Fiber optics engineering: Physical design for reliability

Ephraim Suhir
2014 Facta universitatis - series Electronics and Energetics  
The addressed topics include, but are not limited to, the following major fields: bare fibers; jacketed and dual-coated fibers; coated fibers experiencing thermal and/or mechanical loading; fibers soldered  ...  The review part of the paper addresses analytical modeling in fiber optics engineering. Attributes and significance of predictive modeling are indicated and discussed.  ...  and output; thermal shock; thermal gradients; fatigue (crack propagation) tests; mechanical shock; drop shock (tests); random vibration tests; sinusoidal vibration tests (with the given or variable frequency  ... 
doi:10.2298/fuee1402153s fatcat:icfo7de7j5ftppeevuz2ynduga
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