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Centip3De: A 64-Core, 3D Stacked Near-Threshold System
<span title="">2013</span>
<i title="Institute of Electrical and Electronics Engineers (IEEE)">
<a target="_blank" rel="noopener" href="https://fatcat.wiki/container/gvjkwgwwvnakpbfssxpqjozbqm" style="color: black;">IEEE Micro</a>
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128-core system
Bus
System
University of Michigan
Centip3De System Overview
3D-Stacked DRAM
Tezzaron Octopus
1 control layer
130nm CMOS
1 Gb bitcell layers
Up to two layers ...
1 Core Mode
1 Core Boosted
3 Cores Gated
University of Michigan
[1] http://arm.com/products/processors/cortex-a/cortex-a9.php, ARM Ltd, 2011.Conclusion Near threshold computing (NTC) Need ...
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Centip3De: A 64-core, 3D stacked, near-threshold system
<span title="">2012</span>
<i title="IEEE">
2012 IEEE Hot Chips 24 Symposium (HCS)
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128-core system
Bus
System
University of Michigan
Centip3De System Overview
3D-Stacked DRAM
Tezzaron Octopus
1 control layer
130nm CMOS
1 Gb bitcell layers
Up to two layers ...
1 Core Mode
1 Core Boosted
3 Cores Gated
University of Michigan
[1] http://arm.com/products/processors/cortex-a/cortex-a9.php, ARM Ltd, 2011.Conclusion Near threshold computing (NTC) Need ...
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Centip3De: A 3930DMIPS/W configurable near-threshold 3D stacked system with 64 ARM Cortex-M3 cores
<span title="">2012</span>
<i title="IEEE">
<a target="_blank" rel="noopener" href="https://fatcat.wiki/container/y4cu6znedbgxbdecknzpgfmoli" style="color: black;">2012 IEEE International Solid-State Circuits Conference</a>
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This paper proposes the use of near-threshold computing (NTC) to address this issue in a stacked 3D system. ...
In NTC, cores are operated near the threshold voltage (~200mV above Vth) to optimally balance power and performance [1]. ...
The fabricated Centip3De system consists of two stacked dies with 64 ARM M3 near-threshold cores that make up 16 four-core clusters, each connected to a 4way 1kB instruction cache and a 4-way 8kB data ...
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Centip3De
<span title="2013-11-01">2013</span>
<i title="Association for Computing Machinery (ACM)">
<a target="_blank" rel="noopener" href="https://fatcat.wiki/container/i6iajiiyxvgz3ob6jwcn2pufni" style="color: black;">Communications of the ACM</a>
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Specifically, we will discuss the design and test of Centip3De, a large-scale 3D-stacked near-threshold chip multiprocessor. ...
To address the thermal issues that arise with 3D integration, this paper also evaluates the use of near-threshold computing-operating the system at a supply voltage just above the threshold voltage of ...
/throughput/singlethread performance space. overall, Centip3De achieves a best energy efficiency of 3930 DmiPs/
3930 DMIPS/W Configurable Near-Threshold 3D Stacked System With 64 ARM Cortex-M3 Cores" ...
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Centip3De: A Cluster-Based NTC Architecture With 64 ARM Cortex-M3 Cores in 3D Stacked 130 nm CMOS
<span title="">2013</span>
<i title="Institute of Electrical and Electronics Engineers (IEEE)">
<a target="_blank" rel="noopener" href="https://fatcat.wiki/container/cz5rf4o3ezafnl4kjpq643g32e" style="color: black;">IEEE Journal of Solid-State Circuits</a>
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We present Centip3De, a large-scale 3D CMP with a cluster-based near-threshold computing (NTC) architecture. Centip3De uses a 3D stacking technology in conjunction with 130 nm CMOS. ...
Measured results for a two-layer, 64-core system are discussed, with the system achieving 3930 DMIPS/W energy efficiency, which is > 3x improvement over traditional operation at full supply voltage. ...
In this work, we propose using near-threshold computing (NTC) in 3D design to address these issues [14] , [15] . ...
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Performance and network power evaluation of tightly mixed SRAM NUCA for 3D Multi-core Network on Chips
<span title="">2014</span>
<i title="IEEE">
<a target="_blank" rel="noopener" href="https://fatcat.wiki/container/kucxvipvevedfgtsl3pnvxorse" style="color: black;">2014 IEEE International Symposium on Circuits and Systems (ISCAS)</a>
</i>
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Experiment results on 16-core 3D NoC systems show that the tightly mixed NUCA could provide up to 31.71% and on average 5.95% performance improvement compared to a base 3D NUCA scheme. ...
Our analysis and experimental results provide a guideline to design efficient 3D NoCs with stacking NUCA. ...
[3] [4] propose a low power 64-core system that is called Centip3De. Centip3De has two stacked dies with a layer of 64 ARM M3 near-threshold cores and a cache layer. ...
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Selected Research from Hot Chips 24
<span title="">2013</span>
<i title="Institute of Electrical and Electronics Engineers (IEEE)">
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Power-efficient multicore chip In ''Centip3De: A 64-Core, 3D Stacked Near-Threshold System,'' Ronald G. ...
Centip3De uses throughsilicon vias for 3D integration of 128 cores with 256 Mbytes of DRAM memory. ...
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3D-MMC: A Modular 3D Multi-Core Architecture with Efficient Resource Pooling
<span title="">2013</span>
<i title="IEEE Conference Publications">
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Our 3D system is a low-power 3D Modular Multi-Core (3D-MMC) architecture built by vertically stacking identical layers. ...
This paper demonstrates a fully functional hardware and software design for a 3D stacked multi-core system for the first time. ...
and the stacked memory die contains 256KB SRAM, and Centip3De [9] , a configurable near-threshold 3D stacked system with 64 ARM Cortex-M3 cores. ...
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Thoughts on Winning the 2014 Eckert-Mauchly Award
<span title="">2015</span>
<i title="Institute of Electrical and Electronics Engineers (IEEE)">
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To test the idea, a group of us, led by Ron Dreslinski and Dave Fick, designed and fabricated a 128-core NTC multiprocessor, Centip3De, that stacked processors, caches, and DRAMs. 10 It was a large undertaking ...
More recently, we started to look at operating logic at much lower voltage levels-a regime we called near threshold computing (NTC). ...
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Overview of Swallow --- A Scalable 480-core System for Investigating the Performance and Energy Efficiency of Many-core Applications and Operating Systems
[article]
<span title="2015-04-23">2015</span>
<i >
arXiv
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<span class="release-stage" >pre-print</span>
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We present Swallow, a scalable many-core architecture, with a current configuration of 480 x 32-bit processors. ...
The system provides 240GIPS with each core consuming 71--193mW, dependent on workload. Power consumption per instruction is lower than almost all systems of comparable scale. ...
The Centip3De system [12] aims to use 3-D stacked dies to implement a 64-core system based on the ARM Cortex-M3 processor. ...
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Eurolab-4-HPC Long-Term Vision on High-Performance Computing
[article]
<span title="2018-07-11">2018</span>
<i >
arXiv
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<span class="release-stage" >pre-print</span>
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The objective of the Eurolab-4-HPC vision is to provide a long-term roadmap from 2023 to 2030 for High-Performance Computing (HPC). ...
This document presents the "EuroLab-4-HPC Long-Term Vision on High-Performance Computing" of August 2017, a road mapping effort within the EC CSA1 Eurolab-4-HPC that targets potential changes in hardware ...
"Centip3De: A 3930DMIPS/W configurable
near-threshold 3D stacked system with 64 ARM Cortex-M3
cores". In: 2012 IEEE International Solid-State Circuits Confer-
ence. Feb. 2012, pp. 190-192. ...
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SpiNNaker - programming model
<span title="">2014</span>
<i title="Institute of Electrical and Electronics Engineers (IEEE)">
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Even with isolated printed circuit boards of 864 cores, interesting capabilities are emerging. This paper is the third of a series charting the development trajectory of the system. ...
SpiNNaker is a multi-core computing engine, with a bespoke and specialised communication infrastructure that supports almost perfect scalability up to a hard limit of 2 16 Â 18 ¼ 1;179;648 cores. ...
Centip3De is a 130 nm stacked 3D near-threshold computing (NTC) chip design that distributes 64 ARM Cortex-M3 processors over four cache/core layers connected by face-to-face interface ports [7] . ...
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HETEROGENEOUS ARCHITECTURES FOR PARALLEL ACCELERATION Heterogeneous Architectures for Parallel Acceleration
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To enable a new generation of digital computing applications, the greatest challenge is to provide a better level of energy efficiency (intended as the performance that a system can provide within a certain ...
This constraint applies to digital system across all scales, starting from ultra-low power implanted devices up to datacenters for high-performance computing and for the "cloud". ...
The same approach is followed by Centip3de [3] . Centip3de consists of a large scale 3D-integrated fabric of clusters of Cortex M3 cores. ...
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OPTIMIZATION TECHNIQUES FOR PARALLEL PROGRAMMING OF EMBEDDED MANY-CORE COMPUTING PLATFORMS OPTIMIZATION TECHNIQUES FOR PARALLEL PROGRAMMING OF EMBEDDED MANY-CORE COMPUTING PLATFORMS
<span title="">2017</span>
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Infine il ringraziamento più importante va a Francesca, la mia compagna e l'amore della mia vita. Senza il suo supporto e la sua fiducia nelle mie capacità non avrei mai intrapreso questo percorso. ...
To match conflicting requirements for energy consumption and
performance, near-threshold multi-core systems have been recently pro-
posed [127] [95]
featuring 8 PEs and a TCDM composed by 16 6T-SRAM ...
Centip3de is a clustered-based
fabric of Cortex M3 cores, while PULP presents a similar design based
on OpenRISC cores. ...
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