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RF-system-on-package (SOP) for wireless communications

Kyutae Lim, S. Pinel, M. Davis, A. Sutono, Chang-Ho Lee, Deukhyoun Heo, A. Obatoynbo, J. Laskar, E.M. Tantzeris, R. Tummala
2002 IEEE Microwave Magazine  
This integration and cost path has led the microelectronics industry to believe that this kind of progress can go on forever, leading to so-called "system-on-chip" (SOC) for all applications.  ...  passive library and 3D modules for wireless applications • high-performance, organic-based, multichip-module (MCM) technology.  ...  Several works on modules in which the antenna has been integrated have been presented for mm-wave wireless applications [9] .  ... 
doi:10.1109/mmw.2002.990700 fatcat:ltajxpihx5bvvi7adjfgajsl4a

Networks-on-chip in emerging interconnect paradigms: Advantages and challenges

Luca P. Carloni, Partha Pande, Yuan Xie
2009 2009 3rd ACM/IEEE International Symposium on Networks-on-Chip  
Communication plays a crucial role in the design and performance of multi-core systems-on-chip (SoCs).  ...  Networks-on-chip (NoCs) have been proposed as a promising solution to simplify and optimize SoC design.  ...  On-Chip Antenna. On-chip wireless interconnects were demonstrated first in [47] for distributing clock signals.  ... 
doi:10.1109/nocs.2009.5071456 dblp:conf/nocs/CarloniPX09 fatcat:yrli36qr45fopjvu2lf5vuecuy

EPEPS

2022 IEEE Microwave Magazine  
components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches Submission Deadline: July 10, 2022 Conference Chairs: Zhen Peng • Signal and thermal integrity • Power integrity  ...  to electrical analysis • Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis • Measurement and data analysis techniques for system-level and on-chip structures • High  ... 
doi:10.1109/mmm.2022.3164477 fatcat:epkmkv27arfcfaf2palukxaixi

EPEPS 2021

2021 IEEE Microwave Magazine  
components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches  Signal and thermal integrity  Power integrity and power distribution networks  Low power mobile and personal  ...  , power, and thermal integrity analysis  Measurement and data analysis techniques for system-level and on-chip structures  High volume testing for electronic packages.  ... 
doi:10.1109/mmm.2021.3064097 fatcat:b4wqds2kkvabthibynhaukbmqi

EPEPS 2021

2021 IEEE Microwave Magazine  
components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches  Signal and thermal integrity  Power integrity and power distribution networks  Low power mobile and personal  ...  , power, and thermal integrity analysis  Measurement and data analysis techniques for system-level and on-chip structures  High volume testing for electronic packages.  ... 
doi:10.1109/mmm.2021.3077174 fatcat:itmr5ft2fzamtcvomyjszzp57e

3D heterogeneous sensor system on a chip for defense and security applications

Shekhar Bhansali, Glenn H. Chapman, Eby G. Friedman, Yehea Ismail, P. R. Mukund, Dennis Tebbe, Vijay K. Jain, Edward M. Carapezza
2004 Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI  
These gains will accrue from (a) the avoidance of long on-chip interconnects and chip-to-chip bonding wires, and (b) the cohabitation of sensors, preprocessing analog circuitry, digital logic and signal  ...  This paper describes a new concept for ultra-small, ultra-compact, unattended multi-phenomenological sensor systems for rapid deployment, with integrated classification-and-decision-information extraction  ...  One of the primary benefits of 3D integration is the freedom and efficiency in partitioning and integrating modules with mixed-signal or mixed-technology designs, such as logic, memory, analog, RF/Microwave  ... 
doi:10.1117/12.548199 fatcat:fyftqqciqbckfen4zxvniyjila

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu
2021 IEEE Journal of Microwaves  
, antenna design, and IC-package codesign.  ...  Implementations of state-of-the-art silicon-based phased arrays below 100 GHz are discussed, with emphasis on array architectures for scaling, antenna integration options, substrate materials and process  ...  ACKNOWLEDGMENT The authors would like to thank Alberto Valdes-Garcia and Daniel Friedman for technical discussion and management support.  ... 
doi:10.1109/jmw.2020.3032891 fatcat:rqwr4cm5q5cazmswucwltomkxe

Millimeter-wave imaging of magnetic fusion plasmas: technology innovations advancing physics understanding

Y. Wang, B. Tobias, Y.-T. Chang, J.-H. Yu, M. Li, F. Hu, M. Chen, M. Mamidanna, T. Phan, A.-V. Pham, J. Gu, X. Liu (+9 others)
2017 Nuclear Fusion  
This signal-to-noise ratio can be further increased to 30 × if a single GaAs system-on-chip (SoC) receiver is utilized instead of integrating the receiver system-on-substrate with individual MMICs.  ...  On the other hand, electronic phased arrays utilize multiple antennas to transmit/receive signals instead of a single radiator.  ... 
doi:10.1088/1741-4326/aa5e30 fatcat:vamir2lw6jcslk7bdw64daidpu

Computational electromagnetics for high-frequency IC design

Dan Liao, Changhong Dai, Shiuh-Wuu Lee, T.R. Arabi, G. Taylor
2004 IEEE Antennas and Propagation Society Symposium, 2004.  
As a result, computational electromagnetics, the science of solving Maxwell's equations at both low and high frequencies, has begun to draw anentian from on-chip design community.  ...  In this talk, we will first discuss the need for computational electromagneucs (CEM) in hiah-frequcncy IC design.  ...  On-chip applications cover broadband frequencies from DC to tens of gigahem. (7) 3D complexity. Onship structures are complicated 3D in nature.  ... 
doi:10.1109/aps.2004.1332089 fatcat:omckbqa5hzfxvmfgavhc54re7q

The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

Amlan Ganguly, M. Ahmed, Rounak Singh Narde, Abhishek Vashist, Md Shamim, Naseef Mansoor, Tanmay Shinde, Suryanarayanan Subramaniam, Sagar Saxena, Jayanti Venkataraman, Mark Indovina
2018 Journal of Low Power Electronics and Applications  
This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication.  ...  of the wireless interconnection design.  ...  The wiring complexity of both on-chip and off-chip interconnects exacerbates the problem by posing design challenges, crosstalk, and signal integrity issues [12] .  ... 
doi:10.3390/jlpea8010005 fatcat:mtmupptnb5atzjlyoamee47k2a

Review of Photonic Integrated Optical Phased Arrays for Space Optical Communication

Jingwen He, Tao Dong, Yue Xu
2020 IEEE Access  
A proof-of-concept nonuniform silicon integrated OPA with 64 antennas is designed and a one-dimensional beam steering range of 28° is achieved with beam width of about 0.25°.  ...  The challenges and development trends of large-scale integrated OPA chip applied in space optical communication are also discussed.  ...  Zhihui Liu for her supports in the section of literature review.  ... 
doi:10.1109/access.2020.3030627 fatcat:emog25ahi5g2ppufri5i5ly7he

Wireless Interconnect and the Potential for Carbon Nanotubes

Alireza Nojeh, Andre Ivanov
2010 IEEE Design & Test of Computers  
Acknowledgments We thank the Natural Sciences and Engineering Research Council (NSERCÀ ÀGrant Nos. 341629-07 and 43826-09) and SiliconPro for financial support.  ...  ., ''Reliability of Wireless On-chip Interconnects Based on Carbon Nanotube Antennas,'' Proc. 14th IEEE Int'l Mixed-Signals, Sensors and Systems Test Workshop, IEEE Press, 2008, pp. 1-6.)  ...  ., ''Reliability of Wireless On-chip Interconnects Based on Carbon Nanotube Antennas,'' Proc. 14th IEEE Int'l Mixed-Signals, Sensors and Systems Test Workshop, IEEE Press, 2008, pp. 1-6.) which has direct  ... 
doi:10.1109/mdt.2010.58 fatcat:klj2yvgtjjashebgzeqhtjuyoa

A plasmonic route for the integrated wireless communication of subdiffraction-limited signals

Hao Chi Zhang, Le Peng Zhang, Pei Hang He, Jie Xu, Cheng Qian, Francisco J. Garcia-Vidal, Tie Jun Cui
2020 Light: Science & Applications  
Utilizing the physical merits of spoof surface plasmon polaritons (SPPs), we demonstrate that subdiffraction-limited signals can be transmitted on planar integrated SPP channels with low loss, low channel  ...  For a visualized demonstration, we realize the high-quality wireless communication of two movies on subwavelength channels over the line of sight in real time using our plasmonic scheme, showing significant  ...  Subdiffraction-limited IF signals on the integrated SPP channel are mixed into RF signals by a shared wave produced by a local oscillator (LO) using two harmonic mixers first, which can be regarded as  ... 
doi:10.1038/s41377-020-00355-y pmid:32637080 pmcid:PMC7329838 fatcat:wa3ihx2gczg4zhehdsi3h3rjmu

Reconfigurable integrated optoelectronics

Richard Soref
2011 2011 ICO International Conference on Information Photonics  
We illustrate these modules in detail and discuss 3D ROEIC chips for the highest-performance signal processing.  ...  Integrated optics today is based upon chips of Si and InP.  ...  Riza for his collaboration on the RF beamformer.  ... 
doi:10.1109/ico-ip.2011.5953805 fatcat:jdmbs4ljfrbotlhw5mta42vwpm

Reconfigurable Integrated Optoelectronics

Richard Soref
2011 Advances in OptoElectronics  
We illustrate these modules in detail and discuss 3D ROEIC chips for the highest-performance signal processing.  ...  Integrated optics today is based upon chips of Si and InP.  ...  Riza for his collaboration on the RF beamformer.  ... 
doi:10.1155/2011/627802 fatcat:i7u6lb2bxfgj5ldc4mz47qbdaa
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