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A volume diagnosis method for identifying systematic faults in lower-yield wafer occurring during mass production

Tsutomu Ishida, Izumi Nitta, Koji Banno, Yuzi Kanazawa
2014 2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC)  
In mature level, one lower-yield wafer sometimes occurs singly in a lot.  For example, due to failure of single-wafer processing equipment. Fig.  ...  Yield 100% One lower-yield wafer Baseline Mass production Time Stop!  ... 
doi:10.1109/aspdac.2014.6742968 dblp:conf/aspdac/IshidaNBK14 fatcat:p4tb2amhvzhnvbmbnkoj3bse7m

Application of spatial signature analysis to electrical test data: validation study

Thomas P. Karnowski, Kenneth W. Tobin, Jr., Shaun S. Gleason, Fred Lakhani, Bhanwar Singh
1999 Metrology, Inspection, and Process Control for Microlithography XIII  
At this phase, wafer volume is high and systematic yield loss is hard to detect.  ...  As the exploratory phase moves into the process development phase, higher wafer volumes necessitate the initiation of automation procedures to monitor a significant fraction of product.  ... 
doi:10.1117/12.350840 fatcat:byxtcfpjzzam5mmajs2sl5q4la

Review—Management of Copper Damascene Plating

R. Carpio, A. Jaworski
2018 Journal of the Electrochemical Society  
This includes the use of chemometrics for electroanalytical bath concentration control and optical methods for film thickness, surface roughness, and film stress/wafer curvature measurements.  ...  Planarization issues, yield and reliability concerns, reduction in critical feature size and the shift to 300 mm wafers as well as the adoption of dielectric films with low dielectric constants.  ...  ., wishes to express appreciation to the many staff members at Sematech in Austin, TX for their joint participation in the early copper damascene process developmental and sustaining support.  ... 
doi:10.1149/2.0101901jes fatcat:o6rjnbozsnba3nylocy3lfj3g4

Maintenance Today and Future Trends [chapter]

Andrew Starr, Basim Al-Najjar, Kenneth Holmberg, Erkki Jantunen, Jim Bellew, Alhussein Albarbar
2010 E-maintenance  
Automation and integrated production have resulted in larger technical 6 A.  ...  In other words, the downtime is more important than a small probability of failure. A failure can be acceptable if the repair and restarting times are short.  ...  RCM partitions a machine in a systematic way to analyse its construction by using failure mode and effect analysis (FMEA) in order to identify significant components and failure modes.  ... 
doi:10.1007/978-1-84996-205-6_2 fatcat:yn7lzj5duzez3ozeopymdz4pga

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Abd Al Rahman M. Abu Ebayyeh, Alireza Mousavi
2020 IEEE Access  
This defect occurs due to the steam generated during the production process.  ...  Systematic defects usually follow a specific pattern, for instance, a center pattern (also known as bull's eye) concentrated in the center of a wafer typically occurs when there are uniformity variations  ...  It has been found from the previous keyword search that a lot of researchers who studied electronics defects focused their attention to printed circuit boards PCBs, semiconductor wafers, light emitting  ... 
doi:10.1109/access.2020.3029127 fatcat:hoimi667cndsrimsnwasamtdey

Testing of Flow-Based Microfluidic Biochips: Fault Modeling, Test Generation, and Experimental Demonstration

Kai Hu, Feiqiao Yu, Tsung-Yi Ho, Krishnendu Chakrabarty
2014 IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems  
We show how a fabricated biochip can be tested using the proposed method, and demonstrate experimental results for two additional fabricated chips.  ...  Prior work on fault detection in biochips has been limited to digital ("droplet") microfluidics and other electrode-based technology platforms.  ...  ACKNOWLEDGMENT The authors would like to thank Stanford Microfluidic Foundry for test samples and Q. Delp from Stanford University for helping out with the construction of the test setup.  ... 
doi:10.1109/tcad.2014.2336215 fatcat:7x4lafynbbgmffgmi4ycfqytma

Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring

Vinamra Bhushan Sharma, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma, Jae Pil Jung
2021 Metals  
In this article, a comprehensive review is performed, primarily on the applications of AI models for SHM to maintain the sustainability of diverse civil infrastructures.  ...  Real-time health monitoring of civil infrastructures is performed to maintain their structural integrity, sustainability, and serviceability for a longer time.  ...  fault diagnosis.  ... 
doi:10.3390/met11101537 fatcat:wayx7vsxxrekrgpjrzrmxpqswm

News Briefs

1995 Journal of Research of the National Institute of Standards and Technology  
NIST has collaborated with the Association of American Railways and two Polish research groups to develop ultrasonic methods for detecting stress in wheels.  ...  As a result, NIST engineers currently are reducing the size of the PV array by 25 % and making other modifications to yield a less expensive system.  ...  FAULT DETECTION AND DIAGNOSIS USING ARTIFICIAL NEURAL NETWORKS NIST researchers have completed preliminary research on fault detection and diagnosis (FDD) of building mechanical systems.  ... 
doi:10.6028/jres.100.038 fatcat:ezzama7esraxrhjd2pgiujid4a

Defect and Fault Modeling Framework for STT-MRAM Testing

Lizhou Wu, Siddharth Rao, Mottaqiallah Taouil, Guilherme Cardoso Medeiros, Moritz Fieback, Erik Jan Marinissen, Gouri Sankar Kar, Said Hamdioui
2019 IEEE Transactions on Emerging Topics in Computing  
In addition, a complete single-cell fault space and nomenclature are defined, and a systematic fault analysis methodology is proposed.  ...  This paper presents a systematic device-aware defect and fault modeling framework for STT-MRAM to derive accurate fault models which reflect the physical defects appropriately, and thereafter optimal and  ...  The clear mapping relations between physical defects and fault models are useful for fast defect diagnosis and yield learning.  ... 
doi:10.1109/tetc.2019.2960375 fatcat:zakt2lp2hrfcrc5itzrya2wgce

The D0 Silicon Microstrip Tracker

S.N. Ahmed, R. Angstadt, M. Aoki, B. Åsman, S. Austin, L. Bagby, E. Barberis, P. Baringer, A. Bean, A. Bischoff, F. Blekman, T.A. Bolton (+122 others)
2011 Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment  
In addition, description of the performance of the detector during the experiment data collection between 2001 and 2010 is provided.  ...  This paper describes the mechanical design, the readout chain, the production, testing and the installation of the Silicon Microstrip Tracker of the D0 experiment at the Fermilab Tevatron collider.  ...  Acknowledgements We thank the staff at Fermilab and in particular at SiDet, the D0 mechanical and electrical support personnel and all our d0 collaborators for there support.  ... 
doi:10.1016/j.nima.2010.11.121 fatcat:yzlqjcphenbvjdxes4cwgwuthm

Production and processing of graphene and related materials

Claudia Backes, Amr M Abdelkader, Concepción Alonso, Amandine Andrieux-Ledier, Raul Arenal, Jon Azpeitia, Nilanthy Balakrishnan, Luca Banszerus, Julien Barjon, Ruben Bartali, Sebastiano Bellani, Claire Berger (+125 others)
2020 2D Materials  
We present an overview of the main techniques for production and processing of graphene and related materials (GRMs), as well as the key characterization procedures.  ...  We adopt a 'hands-on' approach, providing practical details and procedures as derived from literature as well as from the authors' experience, in order to enable the reader to reproduce the results.  ...  and high volume production needs.  ... 
doi:10.1088/2053-1583/ab1e0a fatcat:blvnffchsre7fermor2wzz5unq

Earth science abstracts, Papua New Guinea, to 1971

W. Manser
1974 International Journal of Rock Mechanics and Mining Sciences & Geomechanics Abstracts  
A revised generic diagnosis is given in which 31 characters are listed.  ...  In Cannae or Inene I. near the Laughlan Is, a small deposit of phosphate was investigated. Gold production for the year by goldfield, and volume and value of copper production, are listed.  ...  A. et al., 1965 05-a-106-Mabbutt, J. A. et al, 1965 05-a-108  ... 
doi:10.1016/0148-9062(74)90465-3 fatcat:zff4z5fadnam3f7gq3o7rf77hm

The D0 silicon microstrip tracker

Breese Quinn
2003 Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment  
In addition, a short description of the performance of the detector is provided.  ...  The new layer is not described in this paper. 2 18 detectors to improve e/γ identification. Most important is a completely new central tracking system, illustrated in Fig. 2.  ...  Acknowledgements We would thank the staff at Fermilab and in particular at SiDet, the D0 me-  ... 
doi:10.1016/s0168-9002(02)02004-1 fatcat:46ldc4uqkncepbl6igen5wzvae

Modern Applied Science, Vol. 3, No. 12, December, 2009

Editor MAS
2009 Modern Applied Science  
Additional thanks are due to college of sciences of Al-Naherain and University of Mosul, Iraq for their kind technical assistance.  ...  This paper has provided evidence for the impact of remote biomass burning and forest fire on Carbon Dioxide pollution levels above study area and enhanced our knowledge on AIRS detection of CO 2 emission  ...  For inputs to VOUTSENSE greater than 0.82V, as might occur with a lamp that is open or not yet lit, the loop also regulates constant load current, but at a lower current than for a shorted lamp.  ... 
doi:10.5539/mas.v3n12p0 fatcat:7mgcusxchjh3rlfwhv6xex6zqe

The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

Glenn Ross, Per Malmberg, Vesa Vuorinen, Mervi Paulasto-Kröckel
2018 ACS Applied Electronic Materials  
Acknowledgements This research was conducted at Aalto University in the Electronics Integration and Reliability Unit of the Department of Electrical Engineering and Automation.  ...  The advantages of such a strategy are obvious, a reduced footprint, shorter interconnect lengths (reduced latency), less material consumption and higher wafer-to-chip ratio resulting in a higher yield.  ...  This makes realtime chemical analysis of a Cu process difficult. There are methods for electroplating bath analysis, such as mass spectrometry.  ... 
doi:10.1021/acsaelm.8b00029 fatcat:mtosy7yhtnfkvl7s5xenqrmm7u
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