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A Scalable 3D Heterogeneous Multi-Core Processor with Inductive-Coupling ThruChip Interface

Yusuke Koizumi, Noriyuki Miura, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
2014 IEEE Micro  
As a solution, heterogeneous multi-core system using a 3-D wireless inductive coupling interconnect is proposed.  ...  Although flexible reconfigurable architectures can be a solution, the performance scalability is also necessary to cope with the wide performance range of products.  ...  Koizumi, et al, "CMA-Cube: a scalable reconfigurable accelerator with 3-D wireless inductive coupling interconnect", In Proceedings of FPL, Aug. 2012. [2] D.  ... 
doi:10.1109/mm.2013.133 fatcat:rgqkfetp75dnhbv7tps6b7z77y

Program Schedule - October 8, 2019 (Hotel Metropolitan Sendai)

2019 2019 International 3D Systems Integration Conference (3DIC)  
In such a densely assembled modules, crosstalk between closely placed 3DS-ICs like a stacked memories and processors.  ...  Abstract: Multi chip modules (MCMs) employing three-dimensionally stacked ICs (3DS-ICs) are expected to be the integration method to achieve high performance by integrating memories and processors densely  ...  neuromorphic chips, 3D stacked image sensor with extremely high frame rate of 10,000 frames/s and 3D multicore processor with self-test and self-repair function were developed.  ... 
doi:10.1109/3dic48104.2019.9058792 fatcat:6kz54ru5uzdbzeecpentkxprqe

Photonic Interconnection Networks for Applications in Heterogeneous Utility Computing Systems

Cathy Chen
2017
Growing demands in heterogeneous utility computing systems in future cloud and high performance computing systems are driving the development of processor-hardware accelerator interconnects with greater  ...  With delocalized optically-connected hardware accelerator nodes accessible by processors at run time, the system can alleviate the network latency issues plague current heterogeneous systems.  ...  In [52] , a scalable heterogeneous multi-core processor is presented as 3D heterogeneous chip stacking of a CPU and reconfigurable multi-core accelerators in massive parallel computing.  ... 
doi:10.7916/d82806pv fatcat:ha7x4q4nqnawhkgnefddoe5m4e

Development of Silicon Photonic Multi Chip Module Transceivers

Nathan Casey Abrams
2020
The development of silicon photonic foundries supporting multi project wafer runs with associated process design kit components supports a path towards widespread commercial production by increasing production  ...  The central prototype features a photonic integrated circuit with bus waveguides with WDM microdisk modulators for the transmitter and WDM demuxes with drop ports to photodiodes for the receiver.  ...  More exotic alternatives to metal vias exist, such as the ThruChip Interface (TCI), which uses wireless connections through near-field inductive coupling [145] .  ... 
doi:10.7916/d8-k83d-xx06 fatcat:yts2c6kb5javxdudpcwjeuguxq

Annual Report 2015
国立情報学研究所 平成27年度(2015年度)年報

of Symbolic Heaps with Monadic Inductive 6) B.  ...  Inductive Definitions" , current-SQUID magnetometer directly coupled to an electron spin ensemble" ,Applied Physics Mathematics,Vol.283,pp.122-141 (2015.08) 活動概要 Local Adaptation in a Wild Arabidopsis  ... 
doi:10.20736/0000001212 fatcat:utovsw2ruzbzrhdu3jppuntw34