A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit the original URL.
The file type is application/pdf
.
Filters
Seven GHz high gain 0.18 μm CMOS Gilbert downconverter with wide-swing cascode current mirrors
2008
Microwave and optical technology letters (Print)
In the in-band range, the locked signal tracks the low-phase-noise reference signal and provides the obvious improvement of phase noise about 6 dB. ...
The final f max /f min ratio is 6.5, and the output spectrums at maximum and minimum input frequency are shown in Figures 5(a) and 5(b), respectively. ...
downconversion micromixer with low-voltage cascode current mirrors at both transconductor and load stages has been implemented using the 0.18-m CMOS technology in this article. ...
doi:10.1002/mop.23095
fatcat:aevvkkxk2zatlpb7msnrm2cxyu
Bit Error Performance of APD and SPAD Receivers in Optical Wireless Communication
2021
Electronics
In turn, and in combination with fully integrated optical receivers, reduction of cost and increased comfort can be achieved. ...
a standing-wave model for the isolation and passivation stack, is extended. ...
They, however, suffer also from a low responsivity of the photodetector in 0.18 and 0.13 µm CMOS, respectively. ...
doi:10.3390/electronics10222731
fatcat:4ohkx7fvy5abfbnu5733rthasq
Physical design challenges to nano-CMOS circuits
2009
IEICE Electronics Express
First, in line with variation-aware design, a novel ingenious method of measuring variations in subthreshold characteristics is described. ...
There are many challenges inherent in the design of nano-CMOS. This paper describes our recent work relating to the physical design of CMOS circuits. ...
Regarding chip design and fabrication in this work, we are indebted to VDEC, in collaboration with Cadence Design Systems, Inc. and Synopsys, Inc. ...
doi:10.1587/elex.6.703
fatcat:fwyoecgnhbarlfxmqsjmjtjo6a
Novel pure‐metal tri‐axis CMOS‐MEMS accelerometer design and implementation
2021
Micro & Nano Letters
This work proposed a pure-metal, single-proof-mass structure fabricated by the standard 0.18 μm one-poly-silicon six-metal (1P6M) CMOS process along with one inhouse post-CMOS wet-etching approach. ...
The fabricated tri-axis accelerometer reveals stable and consistent results and exemplifies a potential platform design for the highly integrated monolithic CMOS-MEMS system-on-chip applications. ...
In this design, a general-purpose inertial sensor is considered to implement by the standard TSMC 0.18 μm 1P6M CMOS process. ...
doi:10.1049/mna2.12014
fatcat:xsvritixr5cungrsu2nguxgaoq
A Review of Modern CMOS Transimpedance Amplifiers for OTDR Applications
2019
Electronics
The work presents a review of modern CMOS transimpedance amplifiers (TIAs) in the context of their application for low-cost optical time-domain reflectometry (OTDR). ...
A detailed discussion is given on a representative set of approaches reported in the literature and the figure of merit (FOM) is introduced as a unified basis for performance comparison. ...
matching
Jun-De Jin [9], 2006
0.18 µm
51.0
30.5
60.1 @ 1.8V
34.3
0.048
4 cascaded CS-stages with PIP
Park, Oh [15] 1 , 2007
0.18 µm
64
2.1
50 @ 1.8V
33.2
2.76
differential, CG input ...
doi:10.3390/electronics8101073
fatcat:f5s7xcxrbjhuxlqlays2kltwza
A Wideband Noise and Harmonic Distortion Canceling Low-Noise Amplifier for High-Frequency Ultrasound Transducers
2021
Sensors
A high-frequency ultrasound (HFUS) and photoacoustic (PA) imaging front-end, including the proposed LNA and a variable gain amplifier (VGA), was designed and fabricated in a 180 nm CMOS process. ...
This paper presents a wideband low-noise amplifier (LNA) front-end with noise and distortion cancellation for high-frequency ultrasound transducers. ...
Funding: This research received no external funding.
Institutional Review Board Statement: Not applicable. Informed Consent Statement: Not applicable. ...
doi:10.3390/s21248476
pmid:34960568
pmcid:PMC8703952
fatcat:rkdqgscpvzfapd63kgoompbkze
A Low-Power Current-Reuse LNA for 3D Ultrasound Beamformers
2021
IEICE Transactions on Fundamentals of Electronics Communications and Computer Sciences
The LNA was fabricated in a 0.18-µm CMOS process with only 0.0056 mm 2 . The measured results show a gain of 21 dB and a bandwidth of 9 MHz. ...
The supply current is 85 µA with a 1.8-V power supply, which is competitive with conventional LNAs by finer CMOS process. ...
Therefore, design for stability can be treated in the same manner as an open-loop differential LNA.
Measurement Results The proposed LNA was designed and fabricated in a 0.18µm SOI CMOS process. ...
doi:10.1587/transfun.2020gcp0011
fatcat:5bl4rzkiangeziphtp6brxgnyy
12.1 3D ultrasonic gesture recognition
2014
2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC)
Figure 12.1.7 shows a micrograph of the readout IC, which is fabricated in a 0.18μm CMOS process with 32V transistors. For a 1m maximum range, the system presented here uses 13.6μJ per measurement. ...
The 450μm diameter piezoelectric micromachined ultrasound transducers (pMUTs) used in this work are made up of a 2.2μm thick AlN/Mo/AlN/Al stack deposited on a Si wafer and released with a back-side through-wafer ...
Figure 12.1.7 shows a micrograph of the readout IC, which is fabricated in a 0.18μm CMOS process with 32V transistors. For a 1m maximum range, the system presented here uses 13.6μJ per measurement. ...
doi:10.1109/isscc.2014.6757403
dblp:conf/isscc/PrzybylaTSHB14
fatcat:lc7te32wvvbyzgfx3qcvdbvmri
A 24-Gb/s 27 ¿ 1 Pseudo Random Bit Sequence Generator IC in 0.13 ¿m Bulk CMOS
2006
Proceedings of ESSCIRC
The circuit features a trigger output which allows to trigger the eye or the sequence pattern. The circuit is manufactured in 0.13 µm bulk CMOS technology and draws 183 mA at 1.5 V supply voltage. ...
This work presents a 24 Gb/s pseudo random bit sequence (PRBS) generator with a sequence length of 2 7 − 1 . ...
Five stacked transistors at low CMOS supply voltage results in a very low voltage headroom for each transistor and a slower cell. ...
doi:10.1109/esscir.2006.307482
fatcat:mgqq7y3w2jekbpwstwsxeqo36u
2020 Index IEEE Solid-State Circuits Letters Vol. 3
2020
IEEE Solid-State Circuits Letters
., +,
LSSC 2020 102-105
A 0.0082-mm², 192-nW Single BJT Branch Bandgap Reference in 0.18-μm
CMOS. ...
Chen, K., +, LSSC
2020 21-24
Compensation
A 0.0082-mm², 192-nW Single BJT Branch Bandgap Reference in 0.18-μm
CMOS. ...
doi:10.1109/lssc.2021.3051791
fatcat:mnafvr7rwnaffepmblvu6cewvi
High-density mapping of brain slices using a large multi-functional high-density CMOS microelectrode array system
2017
2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)
We present a CMOS-based high-density microelectrode array (HD-MEA) system that enables high-density mapping of brain slices in-vitro with multiple readout modalities. ...
The 4.48×2.43 mm 2 array consists of 59,760 micro-electrodes at 13.5 µm pitch (5487 electrodes/mm 2 ). ...
A. Shadmani received individual support through FP7-MTN "EngCaBra" (Contract 264417). ...
doi:10.1109/transducers.2017.7994006
pmid:28868212
pmcid:PMC5580803
fatcat:45onrfmsk5bppab7xuhjbmjoyi
Inductorless 8.9 mW 25 Gb/s 1:4 DEMUX and 4 mW 13 Gb/s 4:1 MUX in 90 nm CMOS
2010
JSTS Journal of Semiconductor Technology and Science
The MUX/DEMUX mainly consists of differential pseudo-NMOS. In these MUX/DEMUX circuits, logic swing is nearly rail-torail, and a low V dd . ...
A low-power inductorless 1:4 DEMUX and a 4:1 MUX for a 90 nm CMOS are presented. ...
ACKNOWLEDGMENTS This study was partially supported by KAKENHI, MIC.SCOPE, STARC, and VDEC in collaboration with Agilent Technologies Japan, Ltd., Cadence Design Systems, Inc. and Mentor Graphics, Inc. ...
doi:10.5573/jsts.2010.10.3.176
fatcat:hlcbp7kxrfgdnb7llujk2ahqqq
A design methodology for programmable-gain low-noise TIA in CMOS
2021
Journal of Electrical Engineering
The work reports on the design of an area-efficient inductor-less low-noise CMOS transimpedance amplifier suitable for entry-level optical time-domain reflectometers. ...
The work suggests a novel approach for implementing a programmable-gain in capacitive feedback TIA with an independent adjustment of the low- and high-frequency behavior using the input stage biasing impedance ...
Results The proposed amplifier was designed and optimized using TSMC 0.18 µm CMOS process. ...
doi:10.2478/jee-2021-0021
fatcat:s2sq3qb4bnbt5h5ed3jkszimsy
An Optical Filter-Less CMOS Image Sensor with Differential Spectral Response Pixels for Simultaneous UV-Selective and Visible Imaging
2019
Sensors
The developed CIS has a pixel pitch of 5.6 µm and exhibits 172 µV/e− conversion gain, 131 ke− full well capacity (FWC), and 92.3 dB dynamic range. ...
The developed CIS is composed by high and low UV sensitivity pixel types, arranged alternately in a checker pattern. Both pixel types were designed to have matching sensitivities for non-UV light. ...
Funding: This research received no external funding.
Conflicts of Interest: The authors declare no conflict of interest. ...
doi:10.3390/s20010013
pmid:31861428
pmcid:PMC6983105
fatcat:27rkwerh4fhylpk7vkqwcp2bb4
RF/wireless-interconnect: The next wave of connectivity
2011
Science China Information Sciences
In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, ...
To overcome such challenges, we first explore the use of multiband RF/wireless-interconnects which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable ...
Figure 11 11 Schematic of the RF-interconnect implemented in a 3D 0.18 µm CMOS process. ...
doi:10.1007/s11432-011-4225-8
fatcat:ndqip657abfx7mxusorw5zqhp4
« Previous
Showing results 1 — 15 out of 490 results