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2021 IEEE International 3D Systems Integration Conference (3DIC)
To meet the increasing demand for large-scale data analysis, data centers need low latency and significant memory bandwidth, combined with lower power consumption. ... In order to manage costs and deliver high performance products to the market, designers are integrating high bandwidth memory (HBM) stacks with high performance logic die to address this need in 2.5 and ... He is also a member of the APS. ...doi:10.1109/3dic52383.2021.9687605 fatcat:m27oybj3brhilb2m6bkb76k5ia
This great person, who kept a high level of patience in spite of all my nonsense ... I'm very thankful. I'm also grateful to my co-advisor Prof. Dr. Pascal Benoit and his assistant Dr. ... Mehdi Tahoori, this great person from whom I learned a lot, who guided me through my research and give me the flexibility to try and discover, who unleashed my creativity to deal with the most challenging ... A 22-nm Predictive Technology Model (PTM) for metal-gate/high-κ CMOS  is used to simulate all the three implementations. ...doi:10.5445/ir/1000051435 fatcat:wi2gj2oisnf6jj2lnemzam7tny