ウィスカ関係  外部応力型ウィスカにおける現象解明と抑制技術

by Tomoya KIGA, Tadashi ASAI, Yukiko MIZUGUCHI, Yosuke MURAKAMI, Shinji TANAKA, Shigetaka TOMIYA

Published in Journal of The Japan Institute of Electronics Packaging by The Japan Institute of Electronics Packaging.

2008 Volume 11, Issue 5, p356-362

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Year 2008
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DOI 10.5104/jiep.11.356

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ISSN-L: 1343-9677

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ウィスカ関係 外部応力型ウィスカにおける現象解明と抑制技術 Mechanism Analysis for Tin Whisker Growth by Mechanical Stress and Mitigation Technolgy release_tbkacphmajawnejoucvcmvwywi