Inter-Intra Modal Representation Augmentation With Trimodal Collaborative Disentanglement Network for Multimodal Sentiment Analysis

by Chen Chen, Hansheng Hong, Jie Guo, Bin Song

Published in IEEE/ACM Transactions on Audio Speech and Language Processing by Institute of Electrical and Electronics Engineers (IEEE).

2023 Volume 31, p1476-1488

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Type article-journal
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Year 2023

DOI 10.1109/taslp.2023.3263801

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ISSN-L: 2329-9290

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Inter-Intra Modal Representation Augmentation With Trimodal Collaborative Disentanglement Network for Multimodal Sentiment Analysis release_7h2v4s4tpreezi7hrzjez77o2i