@article{下澤_藤枝_1992, 
  title={17 半導体封止用マレイミド樹脂の成形性について}, 
  volume={42}, 
  DOI={10.11364/networkpolymer1951.42.73}, 
  number={0}, 
  publisher={Japan Thermosetting Plastics Industry Association}, 
  author={下澤 and 藤枝, 新悦}, 
  year={1992}
  }