超薄型半導体デバイス用エポキシ樹脂の熱劣化挙動

by Shozo Nakamura, Yusuke Sembo

Published in Seikei-Kakou by The Japan Society of Polymer Processing.

2005 Volume 17, Issue 4, p270-274

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Year 2005
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DOI 10.4325/seikeikakou.17.270

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超薄型半導体デバイス用エポキシ樹脂の熱劣化挙動 Thermal Aging Behavior of Epoxy Resin Used in Ultra-thin Semiconductor Devices release_6mnvnfixkbbzvakdsr4sweoihm