The design and optimization of novel elliptic cylindrical through‐silicon via and its temperature characterization

by Wenbo Guan, Hongliang Lu, Yuming Zhang, Yimen Zhang

Published in Engineering Reports by Wiley.

2022

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Date 2022-02-23
Language en ^?

DOI 10.1002/eng2.12470

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ISSN-L: 2577-8196

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The design and optimization of novel elliptic cylindrical through‐silicon via and its temperature characterization release_2rj5r3gptvcw5hkp7o7fanqicu