SOI Conference, Proceedings of the IEEE International container_zpwra2nkzrdixc2chld2yw2hni

IEEE, Inc

Homepage URLs

http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000705

Example Publications

Thermal Modeling and Device Noise Properties of 3D-SOI Technology

Tze Wee Chen, Jung Hoon Chun, Yi-chang Lu, Reza Navid, Wei Wang, Robert W. Dutton
2007 | SOI Conference, Proceedings of the IEEE International unpublished
doi:10.1109/soi.2007.4357866  

Optimization of Dual-ESL Stressor Geometry Effects for High Performance 65nm SOI Transistors

   dark archive
Xiang-zheng Bo, Paul Grudowski, Vance Adams, Konstantin Loiko, Daniel Tekleab, Stan Filipiak, John Hackenberg, Venkat Kolagunta, Mark Foisy, Li-te Lin, K.h. Fung, Chi-hsi Wu (+2 others)
2006 | SOI Conference, Proceedings of the IEEE International unpublished
doi:10.1109/soi.2006.284411  
130
Known Releases
Preservation Summary [more]
4 preserved and accessble (bright)
126 preserved, inaccessible (dark)
0 no known preservation
Release Types
paper-conference 130
Publication Type  proceedings
Country Code  us
ISSN-L?  1078-621X
    Print:  1078-621X
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