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IEEE Transactions on Components, Packaging, and Manufacturing Technology
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Institute of Electrical and Electronics Engineers
Homepage URLs
http://ieeexplore.ieee.org/servlet/opac?punumber=5503870 |
https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=5503870 |
Example Publications
Flexible Multi-Electrode Arrays with 2D and 3D Contacts for In Vivo Electromyography Recording
Muneeb Zia, Bryce Chung, Samuel Sober, Muhannad S. Bakir
2020
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IEEE Transactions on Components, Packaging, and Manufacturing Technology
doi:10.1109/tcpmt.2019.2963556 pmcid:PMC7150534
Modeling, Fabrication, and Reliability of Through Vias in Polycrystalline Silicon Panels
Qiao Chen, Hao Lu, Venky Sundaram, Rao R. Tummala
2015
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IEEE Transactions on Components, Packaging, and Manufacturing Technology
doi:10.1109/tcpmt.2015.2446435
Comparative Study of Surrogate Modeling Methods for Signal Integrity and Microwave Circuit Applications
Thong Nguyen, Bobi Shi, Hanzhi Ma, Er-Ping Li, Xu Chen, Andreas C. Cangellaris, Jose Schutt-Aine
2021
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IEEE Transactions on Components, Packaging, and Manufacturing Technology
doi:10.1109/tcpmt.2021.3098666
Performance of Online and Offset Micro Pin-Fin Heat Sinks With Variable Fin Density
Carlos A. Rubio-Jimenez, Satish G. Kandlikar, Abel Hernandez-Guerrero
2013
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IEEE Transactions on Components, Packaging, and Manufacturing Technology
doi:10.1109/tcpmt.2012.2225143
Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles
Beomjin Kwon, Thomas Foulkes, Tianyu Yang, Nenad Miljkovic, William P. King
2019
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IEEE Transactions on Components, Packaging, and Manufacturing Technology
doi:10.1109/tcpmt.2019.2936852