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Journal of The Japan Institute of Electronics Packaging
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Japan Institute of Electronics Packaging
Homepage URLs
https://www.jstage.jst.go.jp/browse/jiep/12/7/_contents |
Example Publications
Synergistic Effect in Liquid Crystal Polymeric Composite and Inorganic Filler on Its Highly Thermal Conductivity Equal to That of Magnesium Oxide, and Its Low Thermal Expansion Less than That of Quartz
Takeshi Fujiwara, Takafumi Kuninobu, Kento Ujiiye, Kazuhiro Takizawa
2019
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Journal of The Japan Institute of Electronics Packaging
doi:10.5104/jiep.22.390
What will the Fusion of Electronics and Cosmetics Produce?
Yasuo Kato
2019
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Journal of The Japan Institute of Electronics Packaging
doi:10.5104/jiep.22.454
Hetero-Generous Integration Using Organic Interposer
Kiyoshi Oi, Noriyoshi Shimizu, Toshinori Koyama
2019
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Journal of The Japan Institute of Electronics Packaging
doi:10.5104/jiep.22.367
Development of Thermal Resistance Reducing Agent by Steady State Thermal Resistance Measurement Technology and Measurement of Thermal Resistance Value of Thermal Interface Material
Kunio Mori, Katsuhito Mori, Akihiko Haphoya, Yoshiyuki Ohshi
2019
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Journal of The Japan Institute of Electronics Packaging
doi:10.5104/jiep.22.190
Intensity Estimation of Electromagnetic Emission from Individual ICs Based on Noise Source Amplitude Modulation and Correlation Analysis
Shimpei Yoshino, Kengo Iokibe, Yusuke Yano, Yoshitaka Toyota
2019
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Journal of The Japan Institute of Electronics Packaging
doi:10.5104/jiep.22.218