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IEEE transactions on device and materials reliability
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Institute of Electrical and Electronics Engineers
Homepage URLs
http://ieeexplore.ieee.org/servlet/opac?punumber=7298 |
Example Publications
Proper Referencing of Prior Art
Renuka P. Jindal
2011
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IEEE transactions on device and materials reliability
doi:10.1109/tdmr.2011.2106392
Nondestructive void size determination in copper metallization under passivation
Zhenghao Gan, Cher Ming Tan, Guan Zhang
2003
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IEEE transactions on device and materials reliability
doi:10.1109/tdmr.2003.815285
Failure Precursors for Polymer Resettable Fuses
Shunfeng Cheng, Kwok Tom, Michael Pecht
2010
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IEEE transactions on device and materials reliability
doi:10.1109/tdmr.2010.2053371
IEEE Transactions on Device and Materials Reliability information for authors
2016 | IEEE transactions on device and materials reliabilitydoi:10.1109/tdmr.2016.2602857
Wet Metallization of High Aspect Ratio TSV Using Electrografted Polymer Insulator to Suppress Residual Stress in Silicon
Thomas Dequivre, Gitanjali Kolhatkar, Azza Hadj Youssef, Xuan T. Le, Gessie M. Brisard, Andreas Ruediger, Serge A. Charlebois
2017
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IEEE transactions on device and materials reliability
doi:10.1109/tdmr.2017.2716943